Interconnection Substrate for Skew Measurement in Test Apparatus
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Solution Overview
Problem
Existing test apparatuses face challenges in accurately and efficiently correcting skew between output pins of semiconductor devices, particularly due to the need for high accuracy and rapid correction as semiconductor speeds increase, and the inefficiencies of using probing robots for skew measurement and adjustment.
Innovation Solution
An interconnection substrate with equal-length interconnections and a timing measurement circuit is used to measure and adjust skew between output pins, allowing for precise and rapid skew correction by comparing transition timings and adjusting the skew adjustment section settings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a probing robot is used for skew measurement and adjustment, then measurement capability is provided, but measurement time is excessive and operational complexity increases
Solution Approach 1:
An interconnection substrate is introduced as an intermediary component between the output pins and the timing measurement circuit. This substrate includes equal-length interconnections that connect first and second output pins to a common bonding node, which then connects to the timing measurement circuit. This intermediary structure enables direct electrical connection for skew measurement without requiring a probing robot, thereby reducing measurement time while maintaining measurement capability
Solution Approach 2:
The mechanical probing robot system is replaced with an electrical connection system using the interconnection substrate. Instead of using a mechanical probe to physically contact and measure skew between output pins, the invention uses equal-length interconnections to electrically connect the output pins to a timing measurement circuit, substituting mechanical measurement with electrical measurement for faster operation
2Measurement precision
If skew correction is performed with high accuracy requirements, then measurement precision is improved, but correction time increases
Solution Approach 1:
The interconnection substrate is pre-configured with equal-length interconnections between the output pins and the bonding node. This preliminary structuring of equal-length paths ensures that any skew measured at the bonding node directly reflects the skew between output pins without additional path length differences, enabling accurate and rapid skew correction without requiring complex measurement procedures
3Measurement precision
If equal-length interconnections are used in the interconnection substrate, then skew measurement accuracy is improved, but manufacturing complexity increases
Solution Approach 1:
The equal-length requirement is applied locally only to the interconnections between the output pins and the bonding node, not to the entire interconnection substrate. This localized application of equal-length constraint minimizes the impact on manufacturing while ensuring accurate skew measurement at the critical measurement point. The rest of the substrate can be manufactured with standard routing practices
Data Source
AI summary
There is provided an interconnection substrate used in skew adjustment between output pins in a test apparatus, the test apparatus supplying a test signal to a device under test to test the device under test, the interconnection substrate including: a first terminal coupled to a first output pin that outputs the test signal; a second terminal coupled to a second output pin that outputs the test signal; a first interconnection connecting the first terminal to a bonding node; a second interconnection connecting the second terminal to the bonding node; and a third interconnection connecting the bonding node to an output node, where the first interconnection and the second interconnection have a length equal to each other.