Interconnection Tape for Semiconductor Power Distribution
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Solution Overview
Problem
Miniaturization of semiconductor devices leads to challenges in ensuring sufficient signal terminals while reducing power-supply and ground terminals, which can result in voltage drops and device malfunctions due to excessive reduction of these terminals.
Innovation Solution
The use of ring-shaped interconnection tapes that electrically connect multiple power-supply and ground electrode pads on a semiconductor chip, allowing for fewer power-supply and ground terminals while maintaining stable voltage and enabling more signal terminals, along with connection leads and wire sections for external connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the number of power-supply and ground terminals is reduced to enable device miniaturization, then the device size is reduced, but voltage drop increases causing device malfunction
Solution Approach 1:
The invention transitions from conventional point-to-point power supply connections to a planar interconnection tape structure that distributes power across multiple pads in two dimensions. The interconnection tape extends over multiple electrode pads arranged in specific patterns (e.g., alternating power and ground pads), creating a distributed power delivery network that reduces current density and voltage drop while maintaining compact device footprint.
Solution Approach 2:
The invention combines multiple power-supply and ground electrode pads into a unified interconnection system. The interconnection tape integrates connections to multiple pads simultaneously, merging their functions to provide redundant power pathways. This merging creates multiple parallel current paths that reduce overall resistance and prevent voltage drop even when individual connection points are minimized.
2Quantity of substance
If the number of power-supply and ground terminals is reduced, then fewer terminals are needed, but the number of signal terminals that can be provided is limited
Solution Approach 1:
The invention segments the electrode pad array into distinct functional zones using the interconnection tape structure. Power-supply and ground pads are segmented and distributed in specific patterns (e.g., alternating sequence), while signal pads are allocated in remaining areas. This segmentation allows optimal utilization of limited terminal real estate by assigning specific pads to specific functions based on their positions and electrical characteristics.
Solution Approach 2:
The interconnection tape structure serves multiple functions simultaneously: it provides power delivery, ground reference, and enables signal connections. The same interconnection infrastructure that distributes power also facilitates signal terminal connections, making the terminal array universally functional for both power and signal purposes, thereby maximizing adaptability within constrained terminal counts.
3Reliability
If interconnection tapes are used to connect multiple electrode pads, then voltage drop is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The interconnection tape acts as an intermediary element between the electrode pads and external connections. Rather than requiring direct complex routing between each pad, the tape serves as a mediator that collects and distributes electrical connections systematically. This intermediary structure simplifies the overall manufacturing process by providing a standardized intermediate layer that can be formed using conventional techniques before final wire bonding or lead attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for stable power supply and reduced voltage drop, enabling more signal terminals in miniaturized semiconductor devices, while minimizing the number of power-supply and ground terminals, thus reducing costs and improving reliability and yield.
Implementation Method 1
a first interconnection tape being in contact with each of the plurality of first electrode pads such that the plurality of first electrode pads are electrically connected with each other
Data Source
AI summary
A semiconductor device has a semiconductor chip and a first interconnection tape. The semiconductor chip has a plurality of first electrode pads arranged on a first surface. The first interconnection tape is in contact with each of the plurality of first electrode pads such that the plurality of first electrode pads are electrically connected with each other.