Interconnection Member Through-Hole Structure for Beam Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing interconnection members with through holes face issues with charging and abnormal deflection of charged particle beams due to exposure of insulating layers on side surfaces, leading to reliability concerns.
Innovation Solution
An interconnection member design featuring a conductive film covering the side surfaces of through holes, with a wider first through hole extending into the interconnection portion, ensuring the insulating layer is not exposed and the conductive film's end surface is positioned closer to the beam path, preventing charging and deflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through hole is formed in the substrate, then connectivity is achieved, but insulating layer exposure causes charging and beam deflection
Solution Approach 1:
The patent extracts the harmful insulating layer material from the through hole side surface by forming a conductive film that replaces it. The conductive film is deposited to cover the insulating layer exposure, effectively removing the source of charging effects while maintaining the through hole's connectivity function.
Solution Approach 2:
The patent changes the electrical parameter of the through hole side surface from insulating to conductive by forming a conductive film. This parameter change eliminates the charging effect that occurs when charged particle beams interact with insulating materials, thereby stabilizing beam passage.
2Reliability
If conductive film is formed on through hole side surface, then charging is prevented, but manufacturing complexity increases
Solution Approach 1:
The patent merges the conductive film formation process with the existing through hole fabrication sequence. The conductive film is deposited as part of the interconnection structure formation, combining multiple functions (conductive path and side surface coverage) into a single integrated structure rather than adding separate processing steps.
Data Source
AI summary
A width of a first through hole is greater than a width of a second through hole in a direction orthogonal to a first direction. The first through hole also extends to a part of an interconnection portion in the first direction. A side surface of the first through hole includes a first side surface portion positioned on a substrate and a second side surface portion positioned on the part of the interconnection portion. The interconnection portion includes a third face facing a first face of the substrate, a fourth face positioned on an opposite side with respect to the third face in the first direction, and a fifth face. The fifth face is continuous with the second side surface portion of the first through hole and a side surface of a conductive film, and includes an end surface of the conductive film in the first direction.