Interconnection Structure Via Protrusion Oxidation
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Solution Overview
Problem
The existing manufacturing process of interconnection structures often results in increased resistance and reduced conductivity due to oxidation during prolonged electroplating, which affects the reliability of the interconnection structure.
Innovation Solution
A method involving the formation of a conductive through via in a substrate, followed by removing a portion of the substrate to expose it, applying a dielectric layer, forming an opening that exposes the via, and creating a conductive layer within this opening, which increases the contact area between the via and the circuit pattern, thereby enhancing conductivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the electroplating process time is extended to ensure complete filling of the through hole, then the conductive material layer is fully formed, but oxidation occurs in the conductive layer leading to increased resistance and reduced conductivity
Solution Approach 1:
The patent applies preliminary action by forming the conductive material layer in the through hole first, then removing part of the substrate to expose the via top surface before forming the circuit pattern. This sequence allows the conductive layer to be formed without prolonged electroplating, avoiding oxidation while ensuring complete filling. The exposed via top surface enables direct contact with the circuit pattern, maintaining low resistance connection.
Solution Approach 2:
The patent segments the interconnection structure into distinct components: the conductive through via, the dielectric layer, and the circuit pattern with conductive layer. By separating the via formation from the circuit pattern formation processes, the patent avoids prolonged electroplating that would cause oxidation, while still achieving complete via filling and reliable electrical connection.
2Reliability
If the electroplating process is performed for a short duration to prevent oxidation, then conductivity is maintained, but the through hole may not be completely filled
Solution Approach 1:
The patent performs the electroplating process to form the conductive material layer before removing the substrate to expose the via. This preliminary action allows the via to be completely filled with conductive material in a controlled process, and then the via top surface is exposed to enable direct contact with the circuit pattern, ensuring both complete filling and good conductivity without prolonged electroplating.
Solution Approach 2:
The patent changes the process parameters by altering the sequence of operations: instead of forming the circuit pattern immediately after electroplating, it removes part of the substrate to expose the via top surface first. This parameter change allows the via to be completely filled during electroplating while avoiding oxidation by reducing the time between electroplating and circuit pattern formation.
3Reliability
If the contact area between the conductive through via and the circuit pattern is increased to improve conductivity, then the interconnection structure reliability is enhanced, but the manufacturing process complexity increases
Solution Approach 1:
The patent applies preliminary action by exposing the via top surface before forming the circuit pattern. This allows the via to protrude from the dielectric layer, automatically increasing the contact area between the via and the circuit pattern when the conductive layer is formed in the opening. This approach enhances conductivity and reliability while adding only one additional substrate removal step to the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the conductivity of the interconnection structure by expanding the contact area between the conductive through via and the circuit pattern, thereby preventing reliability issues associated with oxidation and reduced conductivity.
Implementation Method 1
an electroplating process is performed to form a conductive material layer on the seed layer
Implementation Method 2
performing a wet etching process
Data Source
AI summary
An interconnection structure and a manufacturing method thereof are provided. The method includes the following steps. First, a substrate having a first surface and a second surface opposite to each other is provided. Then, a conductive through via extended from the first surface to the second surface is formed in the substrate. Then, a portion of the substrate is removed from the first surface to expose a portion of the conductive through via. Then, a dielectric layer is formed on the substrate, and the dielectric layer covers the exposed conductive through via. Then, an opening is formed in the dielectric layer, wherein the opening exposes a portion of the conductive through via, and the top surface of the conductive through via protrudes from the bottom surface of the opening. Then, a conductive layer is formed in the opening.