Interdigital Transducer Thermal Bridge for Acoustic Wave Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Acoustic wave devices, such as SAW and BAW devices, face inefficiencies in heat dissipation due to low thermal conductivity materials used in dielectric layers, leading to localized heating that affects their operating parameters.

Innovation Solution

Incorporating a thermally conductive bridge within the dielectric material layer, comprising a heat dissipating layer and cap layers with higher thermal conductivity than the dielectric material, to efficiently dissipate heat from interdigital transducer electrodes, preventing short circuits and maintaining device stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If dielectric material layer is used to insulate interdigital transducer electrodes, then electrical insulation is improved, but thermal conductivity deteriorates causing localized heating

Engineering Contradiction:

Improveelectrical insulationVSAvoidlocalized heating

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The dielectric material layer is replaced with a thermally conductive bridge structure in specific localized regions where heat dissipation is needed, while maintaining dielectric insulation in other areas. This allows different parts of the same layer to have different thermal properties - high thermal conductivity where needed for heat dissipation and electrical insulation where needed for circuit isolation.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent employs composite material structures combining dielectric materials with thermally conductive materials. The thermally conductive bridge is formed as a composite structure within the dielectric material layer, integrating materials with complementary properties - electrical insulation from dielectric materials and thermal conduction from specialized thermally conductive materials, thereby simultaneously addressing both insulation and heat dissipation requirements.

Inventive Principle:

Principle #40Composite materials

2Temperature

If thermally conductive bridge is added to dissipate heat, then thermal management is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermally conductive bridge is merged with the existing dielectric material layer structure, combining multiple functions into a single integrated component. Rather than adding separate heat dissipation structures, the invention integrates thermal management functionality directly into the insulating layer, thereby reducing overall device complexity while achieving effective heat dissipation.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The thermally conductive bridge serves multiple functions simultaneously: it provides electrical insulation between adjacent electrodes, conducts heat away from hot spots, and maintains structural integrity of the device. This multi-functionality reduces the need for separate dedicated components for each function, thereby simplifying the overall device architecture.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces heat flux and temperature buildup around the electrodes, maintaining consistent operating parameters and improving the thermal management of acoustic wave devices.

Implementation Method 1

at least one thermally conductive bridge disposed within the dielectric material layer and contacting upper surfaces of at least two adjacent interdigital transducer electrode fingers to dissipate heat therefrom

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

acoustic wave device comprises a piezoelectric substrate, interdigital transducer electrodes including a predetermined number of electrode fingers disposed on an upper surface of the substrate

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS11025220B2Acoustic wave device with high thermal conductivity layer on interdigital transducer

Publication Date: 2021.06.01 SKYWORKS SOLUTIONS INC

AI summary

An acoustic wave device includes a piezoelectric substrate, interdigital transducer electrodes including a predetermined number of electrode fingers disposed on an upper surface of the substrate, and a dielectric material layer having a first portion and a second portion. The first portion is disposed on the upper surface of the substrate and between the interdigital transducer electrode fingers. The second portion is disposed above the interdigital transducer electrode fingers. The acoustic wave device further includes at least one thermally conductive bridge disposed within the dielectric material layer and contacting upper surfaces of at least two adjacent interdigital transducer electrode fingers to dissipate heat therefrom.