Interdigitated Electrode Semiconductor Radiation Detector

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Solution Overview

Problem

Current semiconductor radiation detectors face challenges in heat management, making it difficult to produce large-area detectors with a large number of pixels, and scintillators compromise between radiation absorption efficiency and spatial resolution.

Innovation Solution

A radiation detector design featuring interdigitated electrodes within a radiation absorption layer, bonded to an electronics layer, using materials like GaAs, CdTe, or CZT, with differential biasing and specific electrode configurations to enhance charge carrier collection and reduce heat management issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If semiconductor radiation detectors use direct conversion of radiation into electric signals, then spatial resolution is improved, but heat management becomes difficult for large-area detectors with many pixels

Engineering Contradiction:
Improvespatial resolutionVSAvoidheat management
Core Design Contradiction:
Measurement precisionVSTemperature

Solution Approach 1:

The detector is divided into multiple pixels, each with its own readout circuitry integrated into the semiconductor layer. This segmentation allows independent heat management and signal processing for each pixel, enabling large-area detectors to maintain spatial resolution while managing heat dissipation across the entire detector area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A charge coupling device (CCD) or similar intermediary structure is used to transfer charge carriers generated in the semiconductor layer to readout circuits. This intermediary approach separates the radiation detection function from the signal readout function, allowing optimized heat management in the detection region while maintaining high spatial resolution through direct conversion.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Quantity of substance

If scintillator thickness is increased to improve radiation absorption, then absorption efficiency is improved, but spatial resolution deteriorates due to light spreading and scattering

Engineering Contradiction:
Improveradiation absorption efficiencyVSAvoidspatial resolution
Core Design Contradiction:
Quantity of substanceVSMeasurement precision

Solution Approach 1:

The patent replaces the scintillator-based indirect conversion mechanism with a direct conversion semiconductor detector. Instead of using thick scintillator materials that cause light spreading and scattering, the invention uses a semiconductor layer that directly converts radiation into electric signals, eliminating the light transport problem entirely while maintaining both high absorption efficiency and spatial resolution.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the fundamental detection parameter from optical signal generation (scintillation) to direct electrical signal generation. This parameter change allows the detector to achieve high radiation absorption efficiency through optimized semiconductor layer thickness and composition without suffering from the spatial resolution degradation that occurs in scintillators due to light spreading.

Inventive Principle:
Principle #35Parameter changes

3Quantity of substance

If semiconductor layer thickness is increased to improve radiation absorption, then absorption efficiency is improved, but heat management becomes more difficult

Engineering Contradiction:
Improveradiation absorption efficiencyVSAvoidheat management
Core Design Contradiction:
Quantity of substanceVSLoss of energy

Solution Approach 1:

The semiconductor layer is engineered with local quality variations, including different doping concentrations and material compositions in different regions. This allows optimization of radiation absorption in the bulk while maintaining thin regions or integrated heat dissipation structures that facilitate effective heat management, resolving the contradiction between absorption efficiency and heat management.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves the efficiency of radiation detection by directly converting radiation into electric signals, reducing heat management challenges and maintaining high spatial resolution while optimizing radiation absorption, enabling the production of large-area detectors with multiple pixels.

Implementation Method 1

Semiconductor radiation detectors largely overcome this problem by direct conversion of radiation into electric signals. A semiconductor radiation detector may include a semiconductor layer that absorbs radiation in wavelengths of interest. When a particle of radiation is absorbed in the semiconductor layer, multiple charge carriers (e.g., electrons and holes) are generated and swept under an electric field towards electric contacts on the semiconductor layer.

Methodology Applied
Scientific EffectDirect conversion of radiation into electric signals: Photoelectric Effect

Implementation Method 2

When a particle of radiation is absorbed in the semiconductor layer, multiple charge carriers (e.g., electrons and holes) are generated and swept under an electric field towards electric contacts on the semiconductor layer.

Methodology Applied
Scientific EffectElectric field: Electric Field

Data Source

PatentUS11977191B2Semiconductor radiation detector
Publication Date: 2024.05.07 SHENZHEN XPECTVISION TECH CO LTD
  • US11977191B2 patent drawing
  • US11977191B2 patent drawing
  • US11977191B2 patent drawing

AI summary

Disclosed herein is a radiation detector comprising: an electronics layer comprising a first set of electric contacts and a second set of electric contacts; a radiation absorption layer configured to absorb radiation; a first set of electrodes and a second set of electrodes, wherein the first set of electrodes and the second set of electrodes are interdigitated and extend into the radiation absorption layer in a direction of thickness thereof; wherein the electronics layer and the radiation absorption layer are bonded such that the first set of electrodes are electrically connected to the first set of electric contacts and the second set of electrodes are electrically connected to the second set of electric contacts.