Interdigitated Heat Pipes for Adjacent IC Thermal Management
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Solution Overview
Problem
Chip packages with multiple integrated circuits face thermal management challenges due to non-coplanar top surfaces and mechanical interference between heat sinks, leading to reduced thermal performance when using single or separate heat sinks.
Innovation Solution
The implementation of interdigitated heat pipes in heat sinks for adjacent integrated circuits, which includes a pedestal region for thermal coupling, a ramp region for vertical extension, and a fin region for convective heat transfer, allowing for improved thermal management by preventing mechanical interference and enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate heat sinks are used for each integrated circuit, then thermal management for each circuit is improved, but mechanical interference between heat sinks occurs when circuits are placed close together
Solution Approach 1:
The patent merges two separate heat sinks into a single integrated heat sink structure that serves both integrated circuits. The heat sink includes a base with first and second heat pipes respectively coupled to first and second integrated circuits, eliminating mechanical interference while maintaining thermal management for both circuits through a unified structure
Solution Approach 2:
The patent nests the heat pipes within a shared heat sink base structure. The first heat pipe and second heat pipe are embedded in the same base, allowing them to be thermally coupled to their respective circuits while being mechanically contained within a single heat sink assembly, preventing interference
2Device complexity
If a single heat sink is used for both integrated circuits, then mechanical space is saved, but thermal performance deteriorates due to non-coplanar top surfaces causing thermal-interface material thickness variations
Solution Approach 1:
The patent segments the heat sink base into distinct regions with individual heat pipes for each integrated circuit. The base includes a first region thermally coupled to the first circuit and a second region thermally coupled to the second circuit, allowing each region to be independently optimized for its respective circuit's thermal requirements while maintaining a unified structure
Solution Approach 2:
The patent applies local quality by providing circuit-specific thermal pathways within the unified heat sink. Each heat pipe is positioned and dimensioned to match the thermal characteristics of its associated integrated circuit, with the base having varying thermal conductivity or geometry in different regions to optimize heat transfer from each circuit independently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution facilitates improved thermal performance by allowing interdigitated heat pipes in both fin and pedestal regions, addressing the challenges of non-coplanar surfaces and mechanical interference, thereby enhancing the cooling efficiency of integrated circuits.
Implementation Method 1
heat pipes that conduct heat away from the first integrated circuit
Implementation Method 2
heat pipes having high thermal conductivity, which transport the heat
Implementation Method 3
fins that convectively transfer the heat to an external fluid
Implementation Method 4
transport the heat to fins, which transport the heat away convectively via forced air
Implementation Method 5
a thermal-interface material... variations in the thickness of the thermal-interface material, which can reduce the thermal performance
Data Source
AI summary
A chip package includes adjacent integrated circuits on a circuit board, and separate heat sinks are thermally coupled to the integrated circuits. Because the integrated circuits are in close proximity, heat pipes in the separate heat sinks are interdigitated to prevent mechanical interference between the heat sinks. The amount of interdigitation depends on the separation between the integrated circuits and how the integrated circuits are arranged relative to an external fluid (such as flowing air). At the minimum, the heat pipes in fin regions of the heat sinks (which include fins for convective heat transfer to the external fluid) are interdigitated. However, the heat pipes may be interdigitated in pedestal regions of the heat sinks (which are thermally coupled to the integrated circuits) and/or in ramp regions of the heat sinks (in which vertical positions of the heat sinks change from the pedestal regions to the fin regions).