Interdigitated Lead Frame Module for LED Manufacturing
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Solution Overview
Problem
Conventional lead frame modules for manufacturing LEDs result in significant waste of thin metal sheets, with only about 20% being effectively utilized, leading to resource inefficiency and environmental concerns.
Innovation Solution
A lead frame module integrally formed from a single thin metal sheet, featuring interdigitated lead frames connected to multiple rails, allowing for a denser layout and efficient use of metal, thereby increasing the area utilization and reducing waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If lead frames are arranged in a single row along the length of the rail, then the manufacturing process is simple and easy to operate, but the area utilization of the thin metal sheet is low (only about 20% effective utilization)
Solution Approach 1:
The patent transitions from a one-dimensional single-row arrangement to a two-dimensional multi-row arrangement with interdigitated lead frames. The lead frames are organized in multiple rows extending in different directions,充分利用 the planar space of the thin metal sheet and achieving approximately 80% area utilization.
Solution Approach 2:
The patent employs an interdigitated arrangement where lead frames from different rows are interleaved with each other. The connecting leads of lead frames in one row are positioned between the connecting leads of lead frames in adjacent rows, creating a nested-like structure that maximizes space utilization while maintaining electrical independence.
2Productivity
If multiple lead frames are arranged in a row to increase yield rate, then productivity increases, but the remaining 80% of thin metal sheets become waste causing environmental problems
Solution Approach 1:
The patent extends the arrangement from a single row to multiple rows in a two-dimensional configuration. This allows significantly more lead frames to be packed onto the same area of thin metal sheet, increasing productivity while utilizing approximately 80% of the material area compared to the conventional 20% utilization.
Solution Approach 2:
The patent combines multiple lead frames into a single integrated lead frame module formed from one continuous thin metal sheet. The interdigitated arrangement merges the spatial occupation of multiple rows while maintaining the functional independence of each lead frame, thereby increasing output without proportionally increasing material consumption.
3Area of stationary object
If lead frames are densely arranged to improve area utilization, then material efficiency increases, but the structural complexity and difficulty of manufacturing increase
Solution Approach 1:
The patent divides the thin metal sheet into multiple functional regions corresponding to different rows of lead frames. Each lead frame is segmented with distinct connecting leads and packaging leads, and the interdigitated arrangement segments the space into alternating regions that are easier to manufacture using standard punching processes while achieving high density.
Solution Approach 2:
The patent applies different spatial arrangements to different regions of the lead frame module. The interdigitated pattern is applied locally to maximize area utilization in the active lead frame regions, while the rails and supporting structures maintain simpler configurations. This localized application of complexity achieves high density without overwhelming manufacturing difficulty.
Data Source
AI summary
A lead frame module integrally formed from a single thin metal sheet includes: parallel first and second rails extending in a first direction; and first and second lead frame sets connected to the first and second rails, respectively. The first and second lead frame sets respectively include a plurality of lead frames extending in a second direction perpendicular to the first direction. Each of the lead frames of the first and second lead frame sets has a pair of connecting leads and a pair of packaging leads. Each of the packaging leads is connected to a respective one of the connecting leads. The connecting leads of the lead frames of the first lead frame set are interdigitated with and are connected to the connecting leads of the lead frames of the second lead frame set.