Interdigitated Multi-Pixel Arrays for LED Heat and Resistance Management
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Solution Overview
Problem
High brightness light-emitting devices face limitations due to large series resistance and heat generation at high drive currents, which restrict high current operation and output power.
Innovation Solution
The development of interdigitated multi-pixel arrays with minimized series resistance and improved heat-sinking, achieved by increasing the perimeter of the active region and shrinking the space between the mesa and n-contact, along with optimized pixel geometry for better current spreading and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high drive current is used to increase brightness, then output power is improved, but series resistance causes excessive heat generation
Solution Approach 1:
The device is divided into multiple pixels arranged in an interdigitated array pattern. This segmentation increases the total perimeter length for current injection and extraction, thereby reducing series resistance and improving heat dissipation efficiency at high drive currents while maintaining high output power
2Device complexity
If conventional single-pixel structure is used, then device simplicity is maintained, but series resistance is large and heat sinking is poor
Solution Approach 1:
The patent transitions from a conventional single-pixel structure to an interdigitated multi-pixel array arrangement. This dimensional reorganization increases the perimeter-to-area ratio, providing more pathways for current flow and heat dissipation without significantly increasing the overall device footprint
3Ease of manufacture
If conventional pixel geometry is used, then manufacturing is simple, but current spreading is insufficient
Solution Approach 1:
The interdigitated pixel array employs asymmetric positioning of p-type and n-type contacts in an interlaced pattern. This asymmetric geometry optimizes current spreading across the active region by creating multiple current injection points distributed throughout the pixel structure, improving current uniformity while maintaining fabrication compatibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables high current operation with reduced series resistance, improved current spreading, and effective heat dissipation, resulting in higher brightness and power output while minimizing heat generation.
Implementation Method 1
High brightness light-emitting devices face limitations due to large series resistance... This design enables high current operation with reduced series resistance
Implementation Method 2
High brightness light-emitting devices face limitations due to large series resistance and heat generation... improved heat-sinking, achieved by increasing the perimeter of the active region... effective heat dissipation
Implementation Method 3
devices that convert electrical energy into optical radiation (e.g., light emitting diodes)... A light-emitting device is a widely used semiconductor device whose main characteristic is that it emits energy in the form of light when a current flows through the device
Data Source
AI summary
The present invention discloses a plurality of interdigitated pixels arranged in an array, having a very low series-resistances with improved current spreading and improved heat-sinking. Each pixel is a square with sides of dimension l. The series resistance is minimized by increasing the perimeter of an active region for the pixels. The series resistance is also minimized by shrinking the space between a mesa and n-contact for each pixel.


