Interface Module Air Curtain for Clean Wafer Transfer

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Solution Overview

Problem

During semiconductor fabrication, moisture and contaminants from interface modules can enter wafer storage devices, leading to defects in fabricated layers and reduced production yield due to reactions with residual materials on wafers.

Innovation Solution

A processing arrangement with a flow adjusting unit, including gas nozzles and layered apertures, is implemented to create a vertical air curtain across openings, inhibiting moisture and contaminants from entering wafer storage devices and maintaining a clean environment by channeling gas flows parallel to the wall, thereby separating environments between interface and wafer storage modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If interface modules are used for wafer processing, then wafer fabrication processes can be performed, but moisture and contaminants can enter wafer storage devices causing defects

Engineering Contradiction:

Improvewafer fabrication throughputVSAvoidmoisture and contaminant intrusion

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

A gas flow barrier system acts as an intermediary between the interface module and wafer storage device. Gas nozzles deliver controlled gas flows that create a protective barrier, preventing moisture and contaminants from the interface module from entering the wafer storage device while allowing wafer transfer operations to proceed normally.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The system uses pneumatic gas flows to create a protective barrier. Gas nozzles deliver controlled gas flows that form a physical barrier through fluid dynamics, utilizing pressure differentials and flow patterns to block contaminant intrusion without mechanical contact between components.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Reliability

If gas flows are used to block contaminants, then cleaner environment is maintained, but gas flow control complexity increases

Engineering Contradiction:

Improveenvironmental cleanlinessVSAvoidgas flow control system

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The gas flow control system is segmented into multiple independent nozzles, each with its own gas supply line and control mechanism. This segmentation allows individual nozzle control and simplifies the overall system architecture, making it easier to manage gas flow distribution while maintaining reliable barrier protection.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system controls gas flow parameters (flow rate, pressure, direction) to optimize barrier effectiveness. By adjusting these parameters, the system maintains reliable contaminant blocking while managing complexity through parameter optimization rather than structural complexity.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces the introduction of moisture and contaminants into wafer storage devices, enhancing the throughput of processed wafers and increasing production yield by maintaining a cleaner environment and reducing defects.

Implementation Method 1

The one or more gas nozzles provide a gas flow to the first layer and the first layer disperses the gas flow directed to the second layer. The second layer channels the gas flow in a direction parallel to the wall across the opening defined in the wall.

Methodology Applied

Scientific EffectGas flow:

Implementation Method 2

create a vertical air curtain across openings, inhibiting moisture and contaminants from entering wafer storage devices

Methodology Applied

Scientific EffectAir curtain:

Implementation Method 3

the first layer disperses the gas flow directed to the second layer

Methodology Applied

Scientific EffectGas dispersion:

Implementation Method 4

The second layer channels the gas flow in a direction parallel to the wall across the opening defined in the wall

Methodology Applied

Scientific EffectFlow channeling:

Data Source

PatentUS11923225B2Processing arrangement and method for adjusting gas flow

Publication Date: 2024.03.05 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes initiating a gas flow of a first gas parallel to a wall of an interface module to create an air curtain across an opening defined in the wall. The method includes moving an interface door to reveal the opening, wherein the air curtain restrains a second gas within the interface module from passing through the opening. The method includes transferring a semiconductor wafer through the opening and moving the interface door to cover the opening. The method includes halting the gas flow of the first gas after moving the interface door to cover the opening.