Interface Board with Redirecting Die for High-Density Probe Testing

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Solution Overview

Problem

Existing board technologies for testing heads face limitations in handling high-density contact pads on electronic devices, particularly due to dimensional constraints and difficulties in maintaining optimal probe density and parallelism, leading to issues with electrical connections and probe positioning.

Innovation Solution

An interface board for testing heads is developed using photolithographic techniques, featuring a redirecting die with semiconductor substrate-based contact pads and pins, allowing for flexible distribution and connection of contact probes to both the device and the test equipment, enabling improved probe density and parallelism.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If traditional board technologies are used for testing heads, then manufacturing simplicity is maintained, but probe density and parallelism are limited

Engineering Contradiction:

Improveprobe densityVSAvoidinterface board structure

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The interface board is segmented into multiple functional layers: a substrate layer, a redirecting die layer with semiconductor contact pads, and a contact pin layer. This segmentation allows each layer to be optimized independently for its specific function, enabling high probe density while maintaining manufacturing feasibility through modular construction

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A redirecting die with semiconductor contact pads is introduced as an intermediary component between the contact probes and the board. This intermediary enables spatial transformation and redistribution of contact signals, allowing high-density probe arrangements while maintaining proper electrical connections through the semiconductor substrate's conductive pathways

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If photolithographic techniques are used to create the interface board, then spatial transformation precision is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvespatial transformation precisionVSAvoidmanufacturing process

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

Traditional mechanical drilling and routing methods for creating contact pathways are replaced with photolithographic techniques. This substitution enables precise spatial transformation of contact pad locations through photo-patterned conductive layers, achieving high manufacturing precision while the standardized photolithography process keeps manufacturing complexity manageable

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The manufacturing approach transitions from mechanical parameters (drill bit sizes, routing paths) to photolithographic parameters (photoresist patterns, etch depths, conductor trace widths). This parameter change enables precise spatial control of contact pad distributions and interconnections, achieving the required manufacturing precision through well-controlled semiconductor fabrication processes

Inventive Principle:

Principle #35Parameter changes

3Reliability

If contact probes are pressed against contact pads to ensure good connection, then electrical connection reliability is improved, but probe positioning precision requirements increase

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidprobe positioning precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The interface board is pre-configured with redirecting contact pads and conductive pathways in precise positions during manufacturing. This preliminary action ensures that when contact probes are pressed against the contact pads, the electrical connection is reliably established without requiring extreme probe positioning precision during operation, as the tolerance is built into the pre-manufactured interface structure

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS9069015B2Interface board of a testing head for a test equipment of electronic devices and corresponding probe head

Publication Date: 2015.06.30 TECHNOPROBE

AI summary

An interface board of a testing head for a test equipment of electronic devices is described. The testing head includes a plurality of contact probes, each contact probe having at least one contact tip suitable to abut against contact pads of a device to be tested, as well as a contact element for the connection with a board of the test equipment. Suitably, the interface board comprises a substrate and at least one redirecting die housed on a first surface of that substrate and a plurality of contact pins projecting from a second surface of that substrate opposed to the first surface. The redirecting die includes at least one semiconductor substrate whereon at least a first plurality of contact pads is realized, suitable to contact a contact element of a contact probe of the testing head, the contact pins being suitable to contact the board.