Interface Board Structure for Semiconductor Die Signal Access
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor device testing is the inability to directly access and analyze internal signals due to the configuration of the board and die, which obscures the die and prevents high-frequency signal detection and failure mode analysis.
Innovation Solution
An interface structure with an interface board that includes through board vias, upper and lower connectors, and a fixing unit, allowing direct electrical coupling to testing equipment, enabling the first semiconductor die to be exposed for internal signal analysis and reducing the risk of damage during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the board and die configuration is used to protect the semiconductor die, then the die is protected from damage, but the die is obscured and internal signals cannot be accessed for analysis
Solution Approach 1:
The interface board is divided into distinct functional regions: a first surface for die mounting with bonding pads, a second surface for connector placement, and through-board vias for signal routing. This segmentation allows the die to remain protected on the first surface while enabling signal access through the board structure to connectors on the second surface.
Solution Approach 2:
The interface board acts as an intermediary between the protected semiconductor die and the testing equipment. It provides through-board vias and connectors that mediate signal transmission, allowing internal die signals to be accessed for analysis while the die remains securely mounted and protected on the opposite surface.
2Difficulty of detecting and measuring
If the semiconductor die is exposed for signal analysis, then internal signals can be detected, but the risk of damage during testing increases
Solution Approach 1:
The interface board segments the testing function from the die mounting function. Connectors and test access points are placed on the second surface away from the die, allowing signal analysis without direct exposure of the die to potential damage sources during testing operations.
Solution Approach 2:
The interface board serves as a protective intermediary that enables signal analysis through its connector interface while the die remains protected on the first surface. This mediator approach allows full signal access capability without requiring the die to be physically exposed or vulnerable during testing.
3Adaptability or versatility
If connectors are placed on both surfaces of the interface board, then electrical coupling to testing equipment is enabled, but the device complexity increases
Solution Approach 1:
The interface board is designed with multi-functionality: it provides mechanical support for die mounting, electrical coupling through bonding pads and vias, and connector interfaces for testing equipment. This universal design consolidates multiple functions into a single component, reducing overall system complexity despite the dual-surface connector arrangement.
Solution Approach 2:
The interface board utilizes the third dimension (through-board depth) to route signals via vias from the first surface to the second surface. This dimensional approach allows connectors on both surfaces to be electrically coupled without adding planar complexity, as the connections are established through the board thickness rather than requiring additional lateral routing.
Data Source
AI summary
The present application discloses a semiconductor device with an interface structure and a method for fabricating the interface structure. The interface structure includes an interface board configured to be fixed onto and electrically coupled to a chuck of a testing equipment, and a first object positioned on a first surface of the interface board and electrically coupled to the interface board. The first object is configured to be analyzed by the testing equipment.