Interface Bridge for Source-Synchronous Chiplet Communication
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Solution Overview
Problem
Separate integrated circuit dies with different underlying technologies face challenges in communication due to the difficulty in maintaining the same number of wires between them, especially when fabricated using different lithography techniques or generations, leading to inefficient communication and potential errors.
Innovation Solution
An interface bridge using chip-to-chip interconnects, such as a silicon bridge, enables communication between integrated circuit dies with programmable logic fabric and other dies, employing source-synchronous connections, adaptive logic, and redundancy mechanisms to ensure seamless data transfer and secure configuration of programmable logic fabric.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate integrated circuit dies are fabricated using different lithography techniques or generations, then each die can be optimized for its specific technology, but maintaining the same number of wires between them becomes difficult
Solution Approach 1:
The patent introduces an interface bridge as an intermediary component between separate integrated circuit dies. This bridge contains logic that translates and adapts signals between different wire configurations, allowing dies fabricated with different lithography techniques to communicate effectively despite having different numbers of wires. The interface bridge acts as a mediator that resolves the connectivity mismatch while preserving the ability of each die to be optimized for its specific technology.
2Ease of manufacture
If components are moved off-chip to enable independent development, then different components can be developed according to different schedules, but the number of wires between separate dies becomes difficult to match
Solution Approach 1:
The patent implements dynamic wire configuration capabilities within the interface bridge, allowing the system to adaptively allocate and reconfigure wire connections based on the specific communication needs of different component combinations. This dynamic approach enables independent development of separate dies while providing flexible wire mapping that can accommodate different numbers and types of connections without requiring fixed, pre-determined wire configurations.
3Adaptability or versatility
If separate integrated circuit dies communicate with each other, then modular development is enabled, but communication efficiency may be reduced due to limited physical connections
Solution Approach 1:
The patent employs serialization techniques that transform parallel communication channels into sequential time-multiplexed channels. By converting wide parallel data buses into narrower serial streams that are transmitted over time, the system can maintain high communication efficiency despite having limited physical wire connections between separate dies. This dimensional transformation from space (parallel wires) to time (serial transmission) enables effective modular communication with reduced physical connectivity requirements.
Data Source
AI summary
An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.