Interface Bridge for Source-Synchronous Multi-Die Communication
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Solution Overview
Problem
Separate integrated circuit dies with different underlying technologies face challenges in communication due to the difficulty in maintaining the same number of wires between them, especially when fabricated using different lithography techniques or generations, leading to inefficient communication and potential errors in signal transmission.
Innovation Solution
An interface bridge using chip-to-chip interconnects, such as a silicon bridge, enables communication between integrated circuit dies by implementing source-synchronous connections and adaptive logic to ensure synchronous return signals, along with redundancy mechanisms like active, passive, and encoded redundancy to maintain reliable data transfer across limited physical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate integrated circuit dies are fabricated using different lithography techniques or generations, then each die can be optimized for its specific technology, but maintaining the same number of wires between them becomes difficult
Solution Approach 1:
The patent introduces an interface bridge circuit as an intermediary component between separate integrated circuit dies. This bridge includes configuration circuitry that receives wire mapping information and generates corresponding wire mapping signals to establish proper signal connections. The intermediary handles the complexity of matching different wire configurations, allowing each die to be optimized independently while ensuring reliable communication through automated wire pairing and signal synchronization.
2Ease of manufacture
If components are moved off-chip to enable independent development, then different components can be developed according to different schedules, but communication efficiency between separate dies decreases
Solution Approach 1:
The patent implements preliminary configuration actions where wire mapping information is received and processed before actual signal transmission begins. The configuration circuitry pre-establishes wire pairings and generates mapping signals that optimize communication paths. This preliminary setup includes testing wire connections and configuring the interface bridge to ensure efficient data transfer, thereby maintaining high productivity despite physical separation of components.
Solution Approach 2:
The interface bridge employs dynamic configuration capabilities where wire mapping can be adjusted based on operational requirements. The system can reconfigure connections between separate dies to optimize communication efficiency for different data transfer scenarios, allowing adaptable signal routing that maintains high productivity across varying operational conditions.
3Adaptability or versatility
If separate integrated circuit dies are used, then different fabrication techniques can be employed, but signal transmission reliability may be compromised
Solution Approach 1:
The patent incorporates feedback mechanisms where the interface bridge continuously monitors signal transmission between separate dies. Wire mapping information is received, tested, and used to generate mapping signals that are continuously validated. The system includes configuration circuitry that can detect transmission issues and adjust wire pairings or signaling parameters to maintain reliable communication, ensuring signal integrity despite different fabrication techniques used for each die.
Data Source
AI summary
An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.