Interface Bridge Time-Division Multiplexing for Protocol Interconnect
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Solution Overview
Problem
Separate integrated circuit die with different underlying technologies face challenges in efficient communication due to limitations in the number of wires and bandwidth usage, especially when lower bandwidth protocols are used, leading to reduced efficiency and increased chiplets and channels.
Innovation Solution
An interface bridge using time-division multiplexing (TDM) to alternate data transmissions in different protocols over a channel, allowing for efficient and compact interconnection between transceiver die and programmable logic fabric, while minimizing wire consumption and throttling data rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If lower bandwidth communication interfaces are used, then power consumption and resource usage are reduced, but the number of interface channels/wires blocked increases and communication efficiency decreases
Solution Approach 1:
The patent implements time-division multiplexing where different protocols are transmitted in periodic time slots over the same interface channel. Low-bandwidth protocols are transmitted during designated time slots, allowing the channel to be fully utilized without being blocked, thereby maintaining communication efficiency while reducing power consumption and resource usage.
Solution Approach 2:
The interface bridge dynamically configures time slots and protocol assignments based on real-time bandwidth requirements. This dynamic allocation allows the system to adapt to varying communication needs, optimizing both power consumption and communication efficiency by assigning channels and time slots according to actual demand rather than static configuration.
2Ease of manufacture
If separate integrated circuit die are used with different lithography techniques, then independent development and fabrication are enabled, but the number of wires between die is reduced limiting interface bandwidth
Solution Approach 1:
The patent merges multiple protocol transmissions into a single shared interface channel using time-division multiplexing. By combining control plane and data plane traffic, as well as multiple protocol types, into unified time-sliced channels, the system achieves high-effective-bandwidth communication over a reduced physical wire count, enabling independent die fabrication while maintaining interface capacity.
Solution Approach 2:
The patent adds the time dimension to the traditional spatial wire-based communication model. Instead of increasing bandwidth by adding more wires (spatial dimension), the system multiplexes multiple protocols and data streams over the same physical wires by utilizing different time slots (temporal dimension), effectively increasing capacity without increasing wire count.
3Adaptability or versatility
If more interface channels are allocated to accommodate different protocols, then protocol versatility is improved, but device complexity and number of chiplets increase
Solution Approach 1:
The interface bridge is designed as a universal platform that supports multiple protocols (Ethernet, PCIe, CXL, etc.) over shared time-division multiplexed channels. Rather than implementing separate dedicated channels for each protocol, the bridge dynamically allocates time slots to different protocols based on demand, reducing device complexity while maintaining broad protocol versatility and adaptability.
Data Source
AI summary
Methods and systems that uses time-division multiplexing to send two or more protocols over an interconnect bridge between two die. The two die communicate, using the interconnect bridge, using a first protocol and a second protocol. The first protocol is a down-configured version of a high-bandwidth version passable through the interconnect bridge. Additional data is interleaved over the interconnect bridge. The additional data is received at a first die of the two die using a second protocol, and the first die interleaves the additional data into communications between the first and second die using time-division multiplexing.


