Multi-directional Cooling Structure for Interface Card Heat Dissipation
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Solution Overview
Problem
Current cooling technologies for interface cards, such as graphics cards, are inadequate in managing the high heat generated by increased processing speeds, leading to potential damage and reduced stability and efficiency due to limited cooling effectiveness.
Innovation Solution
A multi-directional cooling structure featuring first and second cooling plates with heat conduction elements and cooling fin sets, allowing for efficient heat transfer and dissipation through both horizontal and vertical pathways, utilizing highly conductive materials like copper for enhanced heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a side opening cooling design is used, then the structure is simple and easy to manufacture, but the cooling effect is limited and cannot effectively dissipate high heat
Solution Approach 1:
The patent transitions from single-direction side opening cooling to multi-directional cooling by adding vertical cooling fins and top cooling plates, creating three-dimensional heat dissipation pathways that extend in multiple spatial dimensions, thereby significantly improving cooling effectiveness while maintaining manufacturing feasibility
2Productivity
If high processing speed is achieved through increased semiconductor density, then performance is improved, but heat generation increases and cooling capacity cannot keep pace
Solution Approach 1:
The cooling system is segmented into multiple independent cooling plates (side cooling plate, top cooling plate) and multiple cooling fin sets, each responsible for specific heat dissipation zones. This segmentation allows distributed heat management across different areas, effectively handling the high heat generation from increased semiconductor density while maintaining processing performance
3Reliability
If effective cooling is not implemented, then power consumption increases and component reliability decreases, but adding complex cooling systems increases device complexity
Solution Approach 1:
The patent merges multiple cooling functions into an integrated cooling system where side cooling plates, top cooling plates, and cooling fins work together as a unified thermal management solution. This combination achieves reliable heat dissipation for component stability while avoiding the need for multiple separate cooling systems, thereby controlling overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat generated by interface cards, reducing the risk of component damage and improving processor stability and reliability by facilitating multi-directional heat dissipation.
Implementation Method 1
the heat generated from the interface card is collected by the first cooling plate and then transferred to the second heat conduction portion through the first heat conduction portion of the heat conduction element
Implementation Method 2
the heat is conducted to the cooling fin sets from the surface of the heat conduction element
Implementation Method 3
the heat is conducted to the cooling fin sets from the surface of the heat conduction element
Data Source
AI summary
A multi-directional cooling structure for an interface card includes: a first cooling plate, configured on the interface card; a second cooling plate, configured at one side of the first cooling plate; at least one heat conduction element, configured on the first cooling plate and second cooling plate, and including a first heat conduction portion positioned on the first cooling plate and a second heat conduction portion in connection with the first heat conduction portion and positioned on the second cooling plate; and at least one cooling fin set, configured on one side of the heat conduction element away from the first and second cooling plates, and in direct contact with the heat conduction element. Therefore, the heat can be conducted not only to one side through the heat conduction element but to the cooling fin sets above, advantageously achieving multi-directional heat dissipation.