Dual-Path Interface Connector Cooling for Optical Module Heat
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Solution Overview
Problem
Conventional interface connectors for optical modules fail to effectively dissipate heat generated by high-power chips, leading to operational issues due to rising temperatures during increased signal transmission rates.
Innovation Solution
The interface connector design incorporates a first heat dissipating member outside the housing connected to the first mating connector and a second heat dissipating member inside the housing connected to the second mating connector, with a connecting member to facilitate heat transfer and dissipation through heat conduction and convection, effectively managing heat from both connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the operating power of chips is increased to allow optical signals to be transmitted over long distances, then the signal transmission capability is improved, but the heat generated by the chips increases
Solution Approach 1:
The heat dissipation system is segmented into multiple independent heat dissipating members (first heat dissipating member for the first mating connector, second heat dissipating member for the second mating connector) positioned at different locations within the housing. This segmentation allows each connector to have dedicated heat dissipation pathways, preventing heat accumulation and enabling higher operating powers without excessive temperature rise.
Solution Approach 2:
Heat dissipating members act as intermediary components between the heat-generating chips/laser diodes and the external environment. These intermediaries conduct heat away from the optical components through thermal conduction and dissipate it to the surrounding air, serving as a mediator that transfers heat from the high-power chips to the environment without allowing direct temperature buildup at the chip level.
2Device complexity
If conventional heat dissipation methods are used, then the structure remains simple, but the heat dissipation effectiveness is insufficient for high-power chips
Solution Approach 1:
The heat dissipation function is merged with the structural housing design. The first and second heat dissipating members are integrated into the housing structure, with accommodating spaces specifically designed to hold these heat dissipation components. This merging allows the housing to serve dual purposes: mechanical support and thermal management, achieving effective heat dissipation without proportionally increasing overall device complexity.
Solution Approach 2:
The heat dissipation design transitions from a single-plane or internal-only approach to a multi-dimensional configuration. Heat dissipating members are positioned both inside the housing (second heat dissipating member) and extending outside the housing (first heat dissipating member), creating three-dimensional heat dissipation pathways. This dimensional expansion significantly improves heat dissipation effectiveness by utilizing both internal and external surfaces for thermal exchange.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat from both mating connectors, addressing the heat dissipation challenges of optical modules with high-power chips by utilizing heat-conductive materials and elastic members to enhance thermal contact and airflow, ensuring reliable operation.
Implementation Method 1
The first heat dissipating member is disposed at the outside of the housing and passes through the housing. The first heat dissipating member extends into the first accommodating space to be connected to the first mating connector. The second heat dissipating member is disposed in the housing. The second heat dissipating member extends into the second accommodating space to be connected to the second mating connector.
Implementation Method 2
The first heat dissipating member comprises a first heat dissipating member body and a first extending part. The first extending part extends from the first heat dissipating member body along the second outer surface.
Data Source
AI summary
An interface connector, comprising a housing, a first heat dissipating member, and a second heat dissipating member. A first accommodating space and a second accommodating space are disposed in the housing. The first accommodating space is adjacent to the second accommodating space. The first accommodating space accommodates a first mating connector. The second accommodating space accommodates a second mating connector. The first heat dissipating member is disposed at the outside of the housing and passes through the housing. The first heat dissipating member extends into the first accommodating space to be connected to the first mating connector. The second heat dissipating member is disposed in the housing. The second heat dissipating member extends into the second accommodating space to be connected to the second mating connector.