Interface Connector Heat Dissipation via Dedicated Thermal Members

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Solution Overview

Problem

Conventional interface connectors for stack-type signal modules face challenges in heat dissipation, particularly with increasing operating power due to higher signal transmission rates, which can affect the operation of optical modules without adequate heat management.

Innovation Solution

The interface connector design incorporates a first heat dissipating member on the outside of the housing and a second heat dissipating member on the circuit board, both extending into accommodating spaces to abut against mating connectors, facilitating heat conduction and dissipation through fin-type components and assembling members, effectively transferring heat away from high-power chips.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the operating power of chips is increased to allow optical signals to be transmitted over long distances, then the signal transmission capability is improved, but the heat generated by the chips increases, affecting the operation of optical modules

Engineering Contradiction:

Improveoperating power of chipsVSAvoidtemperature of optical modules

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent extracts the heat dissipation function from the housing structure by adding dedicated heat dissipating members (first and second heat dissipating members) that extend into the accommodating spaces. These members are specifically designed to contact the mating connectors and conduct heat away from the high-power chips, separating the heat generation source from the housing structure.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The heat dissipating members act as intermediary elements between the high-power chips and the external environment. The first heat dissipating member contacts the first mating connector while the second heat dissipating member contacts the second mating connector, serving as thermal conduits that transfer heat from the chips through the connectors to the housing and ultimately to the surroundings.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If heat dissipation structures are added to the interface connector, then the heat dissipation capability is improved, but the structural complexity of the connector increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidstructural complexity of connector

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the heat dissipation function with the existing housing and assembling members. The first and second heat dissipating members are integrated into the housing structure, and the assembling members serve dual purposes: securing the heat dissipating members in place and providing structural support. This combination approach adds heat dissipation capability without proportionally increasing overall structural complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The assembling members are designed with multi-functionality, serving both as structural components that hold the housing together and as securing elements for the heat dissipating members. The first assembling member secures the first heat dissipating member while the second assembling member secures the second heat dissipating member, reducing the need for additional dedicated fastening components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively dissipates heat from both mating connectors by utilizing heat conduction and convection, ensuring reliable operation even under high-power conditions by reducing thermal resistance and enhancing heat flow.

Implementation Method 1

The heat emitted by the first mating connector can be transferred to the first heat dissipating member by thermal conduction, and then dissipated into the air through the first heat dissipating member

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The heat emitted by the second mating connector can be transferred to the second heat dissipating member by thermal conduction, and then dissipated into the air through the second heat dissipating member

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

dissipated into the air through the first heat dissipating member

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11646528B2Interface connector

Publication Date: 2023.05.09 DONGGUAN LUXSHARE TECH CO LTD

AI summary

An interface connector disposed at a circuit board, comprising a housing, a first heat dissipating member, and a second heat dissipating member. A first accommodating space is disposed in the housing. The first accommodating space accommodates a first mating connector. One side of the housing is disposed at the circuit board. The first heat dissipating member is disposed at the outside of the housing. The first heat dissipating member passes through the housing and extends into the first accommodating space to be connected with the first mating connector. The second heat dissipating member is disposed at the circuit board. The second heat dissipating member passes through the circuit board and the housing and extends into the housing. The heat from the first mating connector is dissipated through the components of the first heat dissipating member. Thus the heat dissipation issue of mating connector having high power chips can be solved.