Interface Die for Stacked Silicon Interconnect HBM Integration
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Solution Overview
Problem
Existing integrated circuit packaging technologies face challenges in efficiently adding high bandwidth memory (HBM) capabilities to programmable ICs like FPGAs without disrupting the existing logic circuit architecture, requiring complex requalification and additional circuitry that alters the clocking network and removes logic blocks.
Innovation Solution
The integration of an interface die and HBM buffer die, sharing the same wafer-level substrate but separated by a scribe line, uses interposer interconnections to connect the programmable IC die to the HBM die, allowing for high-bandwidth connections without altering the programmable IC architecture, and using the same mask set as if they were a single die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If HBM capabilities are added to programmable ICs using existing packaging technologies, then memory bandwidth is improved, but device complexity and qualification requirements increase
Solution Approach 1:
The system is segmented into distinct functional components: a programmable IC die, a fixed feature die (HBM buffer), and an interposer with integrated interconnection lines. This segmentation allows each component to be optimized independently while maintaining high bandwidth through the interposer's dedicated interconnect structure.
Solution Approach 2:
An interposer is introduced as an intermediary component between the programmable IC die and the fixed feature die. The interposer contains interconnection lines that facilitate high-speed data transfer, effectively mediating the connection and enabling HBM capabilities without directly modifying the programmable IC architecture.
2Speed
If HBM capabilities are added to programmable ICs by integrating additional circuitry, then memory bandwidth is improved, but qualification time and costs increase
Solution Approach 1:
By separating the HBM buffer functionality into a distinct fixed feature die rather than integrating it into the programmable IC die, the system avoids the need to requalify the entire programmable IC. Only the fixed feature die requires qualification for HBM operations, significantly reducing qualification time.
Solution Approach 2:
The interposer serves as a mediator that enables HBM functionality through external connection rather than internal integration. This approach allows the programmable IC to maintain its original qualified status while the fixed feature die provides the additional HBM capabilities.
3Speed
If the programmable IC architecture is modified to add HBM support, then memory bandwidth is improved, but adaptability of existing designs decreases
Solution Approach 1:
The HBM buffer functionality is extracted from the programmable IC die and implemented as a separate fixed feature die. This extraction preserves the original programmable IC architecture and its design flexibility while adding HBM capabilities through the external fixed feature die connected via the interposer.
Data Source
AI summary
Methods and apparatus are described for adding one or more features (e.g., high bandwidth memory (HBM)) to an existing qualified stacked silicon interconnect (SSI) technology programmable IC die (e.g., a super logic region (SLR)) without changing the programmable IC die (e.g., adding or removing blocks). One example integrated circuit (IC) package generally includes a package substrate; at least one interposer disposed above the package substrate and comprising a plurality of interconnection lines; a programmable IC die disposed above the interposer; a fixed feature die disposed above the interposer; and an interface die disposed above the interposer and configured to couple the programmable IC die to the fixed feature die using a first set of interconnection lines routed through the interposer between the programmable IC die and the interface die and a second set of interconnection lines routed through the interposer between the interface die and the fixed feature die.