Semiconductor Package Interface Substrate With Through-Semiconductor Vias
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Solution Overview
Problem
Conventional organic substrates for semiconductor packages face limitations in high-density interconnect trace line widths, line-to-line spacing, and contact pad pitch, hindering integration of high-density I/O arrays and increasing fabrication costs due to stringent design rules.
Innovation Solution
The use of an organic interface substrate with through-semiconductor vias (TSVs) allows for a denser pad pitch, enabling high-density routing and reducing fabrication costs by separating the substrate into upper and lower layers with different pitch requirements, utilizing TSVs for interconnects between them.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional organic substrates are used with laminated conductor or build-up layers, then cost-effectiveness and thinness are maintained, but the minimum size of interconnect trace line widths, line to line spacing, and contact pad pitch are limited, hindering integration of high-density I/O arrays
Solution Approach 1:
The substrate is divided into upper and lower organic substrate portions with an interposer in between, allowing each portion to be fabricated with different design rules and pitch requirements. This segmentation enables the lower portion to use relaxed design rules for cost-effective fabrication while the upper portion accommodates high-density I/O arrays through the interposer's through-semiconductor vias and microbumps.
Solution Approach 2:
The interposer acts as an intermediary component between the upper and lower organic substrates. It provides through-semiconductor vias and microbumps that enable high-density interconnects while allowing the lower substrate to maintain relaxed fabrication requirements. The interposer mediates between the conflicting density requirements of the two substrate portions.
2Adaptability or versatility
If organic substrates are used for package substrates, then cost and availability advantages are maintained, but stringent design rules increase fabrication cost where multiple contact pad pitches are utilized
Solution Approach 1:
The substrate structure is segmented into upper and lower portions that can accommodate different contact pad pitches independently. The lower organic substrate can be fabricated with relaxed design rules for cost-effectiveness, while the interposer and upper substrate handle the multiple contact pad pitches required for high-density I/O arrays, thus resolving the conflict between versatility and manufacturing cost.
3Manufacturing precision
If conventional organic substrates are used, then cost-effectiveness is maintained, but the substrate thickness increases and high-density microbump arrays cannot be integrated
Solution Approach 1:
The invention transitions from a planar interconnect architecture to a three-dimensional structure with through-semiconductor vias extending vertically through the interposer. This dimensional change enables high-density microbump arrays to be integrated by routing interconnects vertically through the interposer rather than laterally through the substrate, thereby reducing the required substrate thickness while achieving high density.
Data Source
AI summary
An interface substrate is disclosed which includes an interposer having through-semiconductor vias. An upper and a lower organic substrate are further built around the interposer. The disclosed interface substrate enables the continued use of low cost and widely deployed organic substrates for semiconductor packages while providing several advantages. The separation of the organic substrate into upper and lower substrates enables the cost effective matching of fabrication equipment. By providing an opening in one of the organic substrates, one or more semiconductor dies may be attached to exposed interconnect pads coupled to through-semiconductor vias of the interposer, enabling the use of flip chips with high-density microbump arrays and the accommodation of dies with varied bump pitches. By providing the opening specifically in the upper organic substrate, a package-on-package structure with optimized height may also be provided.