Interface Tuning for Erosion Resistant Coatings

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Solution Overview

Problem

Conventional coating materials for semiconductor processing chamber components suffer from adhesion issues and coefficient of thermal expansion (CTE) differences, leading to cracking and flaking, which compromises their effectiveness in protecting components from corrosive plasma environments.

Innovation Solution

A method involving the deposition of an interface material with specific CTE characteristics between the component and the coating material, using precursors like oxygen-containing, nitrogen-containing, or fluorine-containing materials, to enhance adhesion and control diffusion, nucleation, and porosity, thereby stabilizing the coating layer and improving thermal, mechanical, and chemical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a top coating is provided to protect the underlying component from corrosion and erosion, then protection from corrosive plasma environments is improved, but adhesion issues and CTE differences cause cracking and flaking

Engineering Contradiction:
Improveprotection from corrosion and erosionVSAvoidadhesion and structural integrity
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

An interface layer is introduced as an intermediary between the component and the top coating. This interface layer has CTE properties that are intermediate between the component and coating, and provides improved adhesion to both surfaces, preventing cracking and flaking while maintaining protection from corrosive plasma environments

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The coating system is designed as a composite structure with multiple layers: the component, an interface layer with specific CTE characteristics, and a top coating layer. This composite structure combines the benefits of each layer to achieve both strong adhesion and effective corrosion/erosion protection

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If conventional coating materials are used, then application is simplified, but adhesion issues and CTE differences lead to coating failure

Engineering Contradiction:
Improvecoating application simplicityVSAvoidcoating stability and durability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The interface layer serves as a mediator that simplifies the overall coating system by providing a stable foundation with intermediate CTE properties, eliminating the need for complex multi-layer configurations while ensuring coating stability and preventing failure in plasma environments

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The approach results in coated components with improved thermal, mechanical, and chemical properties, including enhanced adhesion and stability in halogen plasma environments, extending the lifetime and effectiveness of the coating materials.

Implementation Method 1

The layer of interface material may be characterized by a coefficient of thermal expansion (CTE) greater than the component for semiconductor processing and less than the layer of coating material

Methodology Applied
Scientific EffectCoefficient of thermal expansion (CTE): Thermal Expansion

Implementation Method 2

The methods may include generating plasma effluents of the one or more coating deposition precursors

Methodology Applied
Scientific EffectPlasma: Plasma

Data Source

PatentUS20250003061A1Interface tuning for erosion and corrosion resistant coatings for semiconductor components
Publication Date: 2025.01.02 APPLIED MATERIALS INC
  • US20250003061A1 patent drawing
  • US20250003061A1 patent drawing
  • US20250003061A1 patent drawing

AI summary

Exemplary processing methods may include providing a component for semiconductor processing to a processing region of a processing chamber. The methods may include providing one or more interface deposition precursors to the processing region. The methods may include depositing a layer of interface material on the component for semiconductor processing in the processing region. The methods may include providing one or more coating deposition precursors to the processing region. The methods may include depositing a layer of coating material on the component for semiconductor processing in the processing region.