Interference Filter Sealing Structure Bonding Strength
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Solution Overview
Problem
Wavelength tunable interference filters face challenges in achieving both satisfactory bonding strength and sealing performance due to sensitivity to environmental factors and limitations in bonding methods, which affect their reliability and optical characteristics.
Innovation Solution
A sealing structure is introduced where the inter-substrate distance decreases from the outer edges towards the inner portion of the interspace, allowing for different materials and methods to be used for bonding and sealing, with a sealing portion made of parylene or deposited via atomic layer deposition, enhancing both bonding strength and sealing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If direct bonding or anode bonding is used to seal the internal space, then sealing performance is improved, but bonding strength deteriorates due to sensitivity to surface flatness and bonding conditions
Solution Approach 1:
The bonding structure is divided into two distinct portions: a bonding portion for joining substrates and a sealing portion for sealing the internal space. This segmentation allows each portion to be optimized independently - the bonding portion can use methods prioritizing strength while the sealing portion uses methods prioritizing hermetic sealing, resolving the contradiction between bonding strength and sealing performance
Solution Approach 2:
Different regions of the bonding structure are assigned different functions and materials. The bonding portion (at the periphery) uses bonding material optimized for strength, while the sealing portion (extending into the internal space) uses sealing material optimized for hermetic barriers. This local differentiation allows simultaneous achievement of high bonding strength and sealing performance
2Strength
If plasma polymerization film or resin bonding is used, then bonding strength is improved, but sealing performance deteriorates due to difficulty in maintaining hermetic sealing
Solution Approach 1:
The bonding structure is divided into two distinct portions: a bonding portion for joining substrates and a sealing portion for sealing the internal space. This segmentation allows each portion to be optimized independently - the bonding portion can use methods prioritizing strength while the sealing portion uses methods prioritizing hermetic sealing, resolving the contradiction between bonding strength and sealing performance
Solution Approach 2:
Different regions of the bonding structure are assigned different functions and materials. The bonding portion (at the periphery) uses bonding material optimized for strength, while the sealing portion (extending into the internal space) uses sealing material optimized for hermetic barriers. This local differentiation allows simultaneous achievement of high bonding strength and sealing performance
3Reliability
If the internal space is sealed by bonding substrates, then sealing performance is improved, but device complexity increases due to limited bonding methods and thickness control requirements
Solution Approach 1:
The bonding portion serves dual functions: it bonds the first and second substrates together while also providing the structural framework for the sealing portion. This multi-functionality reduces the need for additional separate components, thereby reducing device complexity while maintaining sealing performance
Solution Approach 2:
The bonding structure is divided into two distinct portions: a bonding portion for joining substrates and a sealing portion for sealing the internal space. This segmentation allows each portion to be optimized independently - the bonding portion can use methods prioritizing strength while the sealing portion uses methods prioritizing hermetic sealing, resolving the contradiction between bonding strength and sealing performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves sealing performance, reduces contamination, and maintains the reliability of the interference filter by suppressing degradation from environmental factors, ensuring long-term precision and functionality.
Implementation Method 1
a bonding portion that bonds the first substrate and the second substrate to each other
Implementation Method 2
a sealing portion that is disposed between the first substrate and the second substrate in an interspace that allows an internal space sandwiched between the first substrate and the second substrate to communicate with a space outside the sealing structure, the sealing portion sealing the internal space
Data Source
AI summary
An interference filter includes a first substrate on which a fixed reflection film is provided, a second substrate which faces the first substrate and on which a movable reflection film is provided, a first bonding film that bonds the first substrate and the second substrate to each other, and a sealer that is disposed between the first substrate and the second substrate in a first interspace that allows a first internal space sandwiched between the first substrate and the second substrate to communicate with a space outside the interference filter, the sealer sealing the first internal space, and an inter-substrate distance between the first substrate and the second substrate in the first interspace decreases in a direction from outer circumferential edges of the substrates toward an inner portion of the first interspace in a plan view viewed in a substrate thickness direction.