Interference Shield on Build-Up Carrier for EMI Mitigation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuit packaging faces challenges in mitigating electromagnetic interference (EMI)/radio frequency interference (RFI) due to electromagnetic radiation, which affects signal integrity and power integrity, particularly in high-performance mobile devices operating at RF frequencies.
Innovation Solution
The implementation of a bumpless build-up layer (BBUL) packaging technology with an integrated interference shield, where a conductive material such as nickel or copper is sputtered onto the package to form a shield layer, effectively grounding the interference and preventing it from affecting adjacent devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If EMI/RFI shielding is implemented using traditional methods, then electromagnetic interference protection is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the interference shield formation with the existing build-up layer manufacturing process. The conductive material is deposited on the same substrate during the same manufacturing sequence, merging two functions (shielding and structural layering) into a single integrated process, thereby reducing overall device complexity while maintaining EMI protection
Solution Approach 2:
The build-up layer substrate serves multiple functions: it provides structural support, enables routing separation for coreless architecture, and acts as a foundation for the interference shield. This multi-functionality reduces the need for separate dedicated shielding structures, simplifying the overall package design
2Object-affected harmful factors
If a conductive shield layer is sputtered onto the package, then EMI/RFI reduction is improved, but manufacturing process complexity increases
Solution Approach 1:
The conductive material is deposited on the build-up layer substrate before final package assembly and routing separation. This preliminary action allows the shield to be formed on a stable, flat surface, simplifying the deposition process and ensuring uniform coverage before the package is separated into individual units
Solution Approach 2:
The patent replaces traditional mechanical shielding methods (such as separate metal shields or foils) with a sputtered conductive material layer. This substitution eliminates the need for mechanical assembly of separate shielding components, reducing manufacturing complexity while achieving the same EMI protection effect
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The BBUL packaging technology with an integrated interference shield significantly reduces EMI/RFI, ensuring signal integrity and power integrity by grounding the interference, thus enhancing the performance of mobile devices operating at RF frequencies.
Implementation Method 1
a conductive material such as nickel or copper is sputtered onto the package to form a shield layer
Data Source
AI summary
An apparatus including a die including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier coupled to the die, the build-up carrier including a plurality of alternating layers of patterned conductive material and insulating material, wherein at least one of the layers of patterned conductive material is coupled to one of the contact points of the die; and an interference shield including a conductive material disposed on the die and a portion of the build-up carrier. The apparatus may be connected to a printed circuit board. A method including forming a build-up carrier adjacent a device side of a die including a plurality of alternating layers of patterned conductive material and insulating material; and forming a interference shield on a portion of the build-up carrier.