Interferometer Measurement of Embedded Passive Component Expansion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional circuit board manufacturing methods face challenges in accurately measuring and compensating for the geometric changes of embedded passive components during the lamination process, leading to variations in electrical characteristics and undesirable circuit performance.
Innovation Solution
A method involving the use of optical fiber interferometers to measure dimensional changes of sample pads during the lamination process, allowing for real-time adjustment of passive component designs to compensate for expansion and contraction, thereby reducing tolerance values and improving circuit performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If embedding passive components directly into circuit boards is implemented, then board area requirements decrease and circuit performance increases, but dimensional variations of embedded components occur during lamination causing electrical characteristic errors
Solution Approach 1:
The patent applies preliminary action by measuring the dimensional changes of passive component materials during the lamination process before the actual embedding is complete. The system uses optical interferometry to track expansion and contraction of the passive material in real-time during heating and pressing, allowing compensation values to be calculated and applied to subsequent manufacturing steps, thereby preventing electrical characteristic variations before they occur.
Solution Approach 2:
The patent implements feedback by continuously monitoring the dimensional changes of passive component materials during lamination using optical fiber interferometers. The measured data on expansion and contraction is fed back to adjust and compensate the geometric dimensions of embedded components, creating a closed-loop control system that maintains electrical characteristic consistency despite thermal and mechanical stresses during manufacturing.
2Measurement precision
If conventional measurement methods are used during lamination, then measurement errors increase and operator time increases, but real-time tracking of geometric changes is insufficient
Solution Approach 1:
The patent replaces manual mechanical measurement methods with an optical fiber interferometry system that automatically tracks dimensional changes during lamination. The optical interferometers continuously measure the expansion and contraction of passive component materials without requiring operator intervention, eliminating measurement errors associated with manual methods and freeing operators from time-consuming measurement tasks while providing real-time data.
3Manufacturing precision
If no compensation for material expansion and contraction is applied, then geometric tolerances loosen and circuit performance degrades, but measuring and compensating requires complex measurement systems
Solution Approach 1:
The patent introduces optical fiber interferometers as intermediary measurement devices that bridge the gap between the passive component materials and the compensation system. These interferometers serve as mediators by converting dimensional changes into measurable optical signals that can be processed by compensation algorithms, enabling precise geometric tolerance control through a relatively simple optical measurement approach rather than complex mechanical measurement systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the fabrication of circuit boards with embedded passive components having tighter tolerances and higher circuit performance by accurately tracking and compensating for geometric changes, reducing operator time and measurement errors, and providing instantaneous feedback for process adjustments.
Implementation Method 1
The interferometer can be of any suitable type useful for measuring changes in dimensions occurring at the material layer. For example the interferometer can be a Fabry-Perot interferometer, a Michelson interferometer or a Mach-Zehnder interferometer.
Implementation Method 2
measuring with an interferometer dimensional changes occurring to the sample pad while applying heat and pressure to the multi-layer structure as part of a lamination process
Data Source
AI summary
Systems (200) and methods (300) for measuring geometric changes of a passive material (414) when heat and pressure are applied thereto. The methods involve forming a pad (108, 510) on a passive material panel (410). The pad includes at least one of a layer of a passive material (414) and a layer of a metal (416). The methods also involve coupling an interferometer (810) to the pad. The method also involves forming a multi-layer structure by placing at least one substrate panel (400) on top of the passive material such that an aperture (602) formed in the substrate panel is aligned with the pad. Pressure and heat are applied to the multi-layer structure. Data is collected using the interferometer while the pressure and heat are applied to the multi-layer structure. The interferometer can include, but is not limited to, a Fabry-Perot interferometer, a Michelson interferometer and/or a Mach-Zehnder interferometer.