Interferometric Radioimaging for Real-Time HV Breakdown Localization

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Solution Overview

Problem

Current diagnostics for high-voltage breakdown in electrical components lack the ability to accurately locate failure sites in real-time, especially for internal breakdowns, and existing methods provide low-fidelity measurements, failing to detect precursors to catastrophic failures.

Innovation Solution

An interferometric radioimager using an array of at least three radiofrequency sensors arranged to provide multiple angles, allowing for real-time, high-fidelity radioimaging of high-voltage breakdowns, capable of detecting both internal and external breakdowns with sub-nanosecond and sub-millimeter resolution, utilizing D-dot electric field sensors and cross-correlation of radiofrequency signals to create precise radioimages.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If existing diagnostic methods (current/voltage measurements, optical measurements, UHF/acoustic emissions) are used to detect high-voltage breakdown, then detection capability is provided, but location precision and imaging fidelity are insufficient

Engineering Contradiction:
Improvelocation precisionVSAvoidimaging fidelity
Core Design Contradiction:
Measurement precisionVSLoss of information

Solution Approach 1:

The system divides the detection task into multiple independent radiofrequency sensors (at least three) arranged in an array, each sensor contributing to the overall imaging capability. This segmentation allows for precise localization through triangulation while maintaining comprehensive imaging coverage, resolving the contradiction between location precision and imaging fidelity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from traditional single-dimension or two-dimension detection methods to three-dimensional radiofrequency imaging. By using an array of sensors with different baseline orientations, the system creates a spatial dimension for precise localization, achieving both high location precision and complete imaging fidelity simultaneously.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If traditional diagnostic methods are used, then detection is possible, but real-time tracking capability is lacking

Engineering Contradiction:
Improvereal-time tracking capabilityVSAvoiddetection accuracy
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The radiofrequency sensor array provides continuous real-time monitoring of high-voltage breakdown events. The system maintains constant detection capability across the monitored space, enabling real-time tracking without sacrificing measurement precision. The interferometric processing continuously updates the imaging data, ensuring both real-time productivity and accurate measurement.

Inventive Principle:
Principle #20Continuity of useful action

3Device complexity

If single-sensor or simple array configurations are used, then device complexity is reduced, but the ability to locate and image breakdowns with high fidelity is compromised

Engineering Contradiction:
Improvesensor array configurationVSAvoidbreakdown localization accuracy
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

Each sensor in the array is strategically positioned with specific baseline orientations to optimize local detection quality. The interferometric processing exploits the unique geometric relationships between sensor pairs to achieve precise localization. This localized optimization across the array maintains manageable device complexity while achieving high measurement precision through the collective contribution of each sensor's unique viewing angle.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables real-time, high-fidelity imaging of high-voltage breakdowns, allowing for early detection of weaknesses and non-destructive screening of electrical components, pinpointing defects in transformers, capacitors, and microelectronics, and providing critical insights into plasma research and component design.

Implementation Method 1

High-voltage breakdown (HVB; e.g., corona/sparks/arcs/streamers) is a broadband source of electromagnetic radiation generated by motions of free charges in plasma

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Implementation Method 2

An interferometric radioimager for real-time radioimaging of high-voltage breakdown... each pair of sensors in the array is separated by a baseline distance and wherein each baseline is oriented differently... providing at least three separate angles to the radiofrequency source

Methodology Applied
Scientific EffectInterference: Interference

Data Source

PatentUS11808800B2Radioimaging for real-time tracking of high-voltage breakdown
Publication Date: 2023.11.07 NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA LLC
  • US11808800B2 patent drawing
  • US11808800B2 patent drawing
  • US11808800B2 patent drawing

AI summary

An interferometric radioimager provides real-time, high-fidelity radioimaging of high voltage breakdown (HVB) both internal and external to electrical components at sub-nanosecond and sub-millimeter resolution and has an ability to resolve multiple/spatially-extensive HVB simultaneously. Therefore, radioimaging can be used to screen for early life weakness/failure and enable non-destructive screening of defective electrical components. In particular, radioimaging can detect precursors to catastrophic HVB, allowing for early detection of weakness in critical electrical components. Radioimaging can also be used to track HVB and pinpoint defects in electrical components real time, including transformers, capacitors, cables, switches, and microelectronics.