Interlaced Bi-Sensor Pixel Array for Single-Chip Super-Resolution

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Solution Overview

Problem

Conventional bi-sensor super-resolution techniques require two sensors, lenses, processors, and batteries, increasing complexity and cost, and necessitate identical optical paths, which is costly and complex.

Innovation Solution

Interlacing a first array of pixels with a second array of different pitch to form a repeatable modular block for a dual-array single sensor, avoiding photosensitive area overlap, thus achieving bi-sensor super-resolution capabilities with a single sensor setup.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If two sensors are used for bi-sensor super-resolution, then image resolution is enhanced, but device complexity and cost increase significantly

Engineering Contradiction:
Improveimage resolutionVSAvoidsystem complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges two separate sensor arrays into a single integrated sensor device. The first and second sensor arrays with different pitches are combined in one sensor package, eliminating the need for two separate cameras, lenses, processors, and batteries. This reduces system complexity while maintaining bi-sensor super-resolution capabilities through the interlaced arrangement of pixels from both arrays.

Inventive Principle:
Principle #5Merging (Combining)

2Measurement precision

If two sensors are used for bi-sensor super-resolution, then image resolution is enhanced, but cost increases due to multiple components

Engineering Contradiction:
Improveimage resolutionVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent combines two sensor arrays into a single sensor device, reducing the bill of materials and manufacturing costs. Instead of requiring two complete camera systems with lenses, processors, and power sources, the invention achieves bi-sensor functionality in one integrated package, significantly lowering both component costs and assembly expenses.

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If identical optical paths are ensured for both sensors, then measurement accuracy is improved, but device complexity increases due to beamsplitter and calibrated optical setup

Engineering Contradiction:
Improveoptical path accuracyVSAvoidoptical setup complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent uses a single optical path for both sensor arrays within the same sensor device. Since both sensor arrays are integrated in one sensor package with different pitches, they naturally share the same optical path without requiring beamsplitters or complex calibrated optical setups. This eliminates the optical complexity while maintaining accurate measurement through the interlaced pixel arrangement.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the sensor design, reduces costs to that of a single camera setup, maintains silicon area efficiency, and satisfies sampling rate diversity requirements without the need for two sensors, while providing enhanced image resolution.

Implementation Method 1

a first array of pixels of a first size with a second array of pixels of a second size in an interlaced fashion such that crossing of two or more photosensitive areas of the first array of pixels and the second array of pixels is avoided

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Data Source

PatentUS10445454B2Interlaced bi-sensor super-resolution enhancement
Publication Date: 2019.10.15 KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY
  • US10445454B2 patent drawing
  • US10445454B2 patent drawing
  • US10445454B2 patent drawing

AI summary

Interlaced bi-sensor super-resolution enhancement techniques and a resultant scalable pixel array suitable for a mega-pixel design are disclosed. The method includes interlacing a first array of pixels of a first size with a second array of pixels of a second size. The interlacing of the first array of pixels with the second array of pixels avoids crossing two or more photosensitive areas of the first array of pixels and the second array of pixels.