Interlaced Busbar Layout With Central Cooling Channel
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Solution Overview
Problem
High temperatures and unsymmetrical cross capacitance in busbars due to high current transmission, leading to potential overheating and damage to connected components, and unsymmetrical cooling capabilities.
Innovation Solution
A busbar design with interlaced sheet-shaped conductors separated by electric isolation, allowing for a central cooling channel and equal surface exposure, which enables efficient cooling and symmetrical capacitance, reducing magnetic fields and leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high currents are transmitted through busbars, then power delivery capability is improved, but temperature increases due to losses
Solution Approach 1:
A cooling medium is introduced as an intermediary substance flowing through the central channel formed by the interlaced conductors. This cooling medium acts as a heat transfer mediator, absorbing heat from the conductor surfaces and carrying it away, thus enabling high current transmission while maintaining acceptable temperature levels.
Solution Approach 2:
The busbar design transitions from a solid stacked configuration to an interlaced three-dimensional structure with a central channel. This dimensional change creates internal cooling passages without increasing the external footprint, allowing heat dissipation through the newly created internal dimension while maintaining compact power delivery capability.
2Volume of moving object
If conductors are stacked on each other, then compact structure is achieved, but unsymmetrical cross capacitance and poor cooling capabilities occur
Solution Approach 1:
The busbar is segmented into multiple sheet-shaped conductors that are interlaced rather than simply stacked. This segmentation creates distinct cooling surfaces for each conductor within the central channel, ensuring that each conductor segment has access to cooling media and achieves symmetrical cooling capabilities while maintaining overall compactness.
Solution Approach 2:
The design transitions from two-dimensional stacking to a three-dimensional interlaced configuration with a central cooling channel. This dimensional evolution allows each conductor to be positioned with equal exposure to the cooling medium, achieving symmetrical cooling while preserving compact form factor.
3Area of stationary object
If conductors are placed close together for compact design, then space efficiency is improved, but heat dissipation becomes difficult
Solution Approach 1:
The busbar employs a three-dimensional interlaced configuration that creates internal cooling surfaces without increasing the external footprint. The central channel provides heat dissipation pathways within the existing compact volume, enabling efficient heat removal while maintaining small footprint through vertical and internal space utilization rather than horizontal expansion.
Solution Approach 2:
A cooling medium is introduced as an intermediary heat transfer substance that flows through the central channel formed by the interlaced conductors. This mediator enables efficient heat dissipation from the closely spaced conductors by conducting heat away through the cooling fluid, thus allowing compact design while maintaining effective heat dissipation.
4Adaptability or versatility
If unequal surface areas are used for conductors, then design flexibility is improved, but unsymmetrical capacitance and magnetic fields occur
Solution Approach 1:
The invention deliberately employs asymmetry in the interlacing pattern and conductor positioning within the central channel to achieve symmetrical electrical characteristics. By carefully designing the asymmetric interlaced configuration, equal surface areas are exposed to the cooling medium, ensuring symmetrical capacitance and balanced magnetic field distribution, thus eliminating harmful electromagnetic effects while maintaining design flexibility.
Solution Approach 2:
The design ensures that all conductors have equal surface areas exposed to the cooling medium, creating equipotential conditions for heat dissipation and electrical characteristics. This equipotentiality in surface exposure ensures symmetrical capacitance values and balanced magnetic field generation, eliminating harmful electromagnetic interference while preserving the necessary design flexibility for different applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency, maintains symmetrical capacitance, and minimizes magnetic interference, while supporting high current transmission without risk of short circuits.
Implementation Method 1
Transmission of high currents lead to high temperatures due to losses in busbars
Implementation Method 2
a cooling media could be used within the interlaced busbars for cooling of the busbar
Implementation Method 3
the conductors are separated by an electric isolation
Implementation Method 4
symmetrical capacitance between busbars
Implementation Method 5
cancellation of the magnetic field induced from current
Data Source
Figure 1~2A-A
AI summary
A busbar (1) comprising two or three more sheet-shaped conductors (2, 3, 4), wherein said conductors (2, 3, 4) overlap each other and define an elongated body having a central channel (5), and wherein the conductors (2, 3, 4) are separated by an electric isolation (6), and wherein each conductor (2, 3, 4) has a surface (2a, 3a, 4a) exposed to the channel (5), and wherein the area of said surface (2a, 3a, 4a) of each conductor (2, 3, 4) is equal the area of said surface (2a, 3a, 4a) of each of the other conductors (2, 3, 4).