Interlaced Heat Dissipating Fins With Groove Assemblies
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Solution Overview
Problem
Current heat dissipating modules for electronic components in computers do not achieve optimal heat dissipation efficiency due to limited contact area with the working fluid, leading to potential overheating and failure.
Innovation Solution
A heat dissipating module comprising interlaced first and second heat dissipating fins with groove assemblies and units, forming a diamond structure, which increases the contact area with the working fluid and facilitates efficient heat transfer through interconnected channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat dissipating modules are used with simple fin structures, then the device complexity is low, but the heat dissipation efficiency is insufficient due to limited contact area with working fluid
Solution Approach 1:
The heat dissipating module is divided into multiple heat dissipating fins, each containing multiple groove assemblies with groove units. This segmentation creates numerous interconnected channels that increase the contact area between the working fluid and the heat dissipating surface, thereby improving heat dissipation efficiency while maintaining a modular structure
Solution Approach 2:
The invention introduces groove structures that extend into the thickness direction of the heat dissipating fins, creating three-dimensional interconnected channels. This dimensional transformation from simple planar fins to fins with depth-wise grooves significantly increases the surface area contact with working fluid without substantially increasing the overall footprint of the heat dissipating module
2Reliability
If the contact area with working fluid is increased through complex fin structures, then heat dissipation efficiency improves, but the manufacturing difficulty increases
Solution Approach 1:
By dividing the heat dissipating fins into multiple groove assemblies with multiple groove units, the complex three-dimensional channel structure is created through systematic repetition of standardized groove patterns. This segmented approach allows for more straightforward manufacturing compared to creating entirely custom complex geometries, as the groove assemblies can be formed using standardized machining or molding processes
Solution Approach 2:
The groove units are nested within groove assemblies, which are in turn arranged within the heat dissipating fins. This nested structure allows the complex interconnected channels to be formed through hierarchical organization of simpler geometric elements, facilitating manufacturing through staged processing or modular assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves enhanced heat dissipation efficiency by increasing the contact area with the working fluid, allowing for effective heat exchange and temperature regulation, thereby preventing overheating of electronic components.
Implementation Method 1
The first heat dissipating fins and the second heat dissipating fins are combined with each other to form a heat dissipating module, which is disposed on a heat source to heat dissipate for the heat source
Implementation Method 2
a heat dissipating module having a preferred heat dissipating efficiency for a heat source... larger contacting area with a working fluid to have a preferred heat-dissipation efficiency
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
A heat dissipating module including multiple first heat dissipating fins and multiple second heat dissipating fins combined to the first heat dissipating fins is provided. Each first/second heat dissipating fin has a first/second body and multiple first/second heat dissipating groove assemblies disposed in the first /second body, wherein each first/second heat dissipating groove assembly has multiple first/second heat dissipating groove unit. One end of the first heat dissipating groove unit is overlapped to one end of the second heat dissipating groove unit adjacent thereof. The other end of the first heat dissipating groove unit is overlapped to one end of another second heat dissipating groove unit. The two second heat dissipating groove units are disposed in the second body adjacent to each other.