Interlaced Gas Feed and Removal Showerhead for Uniform Distribution
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Solution Overview
Problem
In semiconductor and flat-panel display processing, existing gas distribution systems lead to non-uniform gas flow velocity, pressure, and chemical species distribution across the wafer surface due to center feed and edge exhaust, resulting in process non-uniformity and by-product accumulation.
Innovation Solution
The proposed gas distribution module design features interlaced gas feed and removal components with a housing having upper and lower plenums, where gas flows through multiple passages from the upper plenum to the lower plenum and vice versa, ensuring uniform gas distribution and local removal of by-products, minimizing variations in chemical species, flow velocity, and pressure across the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If center feed and edge exhaust gas distribution is used, then gas flow can be supplied to the wafer, but flow velocity and pressure variations occur from center to edge leading to process non-uniformity
Solution Approach 1:
The gas distribution plate is segmented into multiple independent gas supply channels (e.g., 8-16 channels) radiating from the center, with each channel providing gas to a specific angular sector. This segmentation allows independent control and optimization of gas flow in different regions, eliminating the radial gradient problems of center feed systems.
Solution Approach 2:
Different regions of the gas distribution plate are designed with different properties: the center region has gas supply channels with specific flow rates, while the edge regions have corresponding supply channels and exhaust openings configured to match local flow requirements. This local optimization ensures uniform gas distribution across the entire wafer surface.
2Quantity of substance
If conventional gas distribution plates are used, then gas can be distributed across the wafer, but by-products accumulate leading to adverse effects on wafer surface process
Solution Approach 1:
Exhaust openings are strategically positioned and sized to remove by-products before they can accumulate and adversely affect the wafer surface process. The exhaust system is designed in advance to match the gas supply pattern, ensuring continuous removal of reaction by-products throughout the deposition process.
Solution Approach 2:
The exhaust system converts the harmful accumulation of by-products into a beneficial continuous removal process. By positioning exhaust openings to coincide with regions of high by-product generation, the system transforms potential contamination into controlled removal, improving process uniformity and wafer quality.
3Manufacturing precision
If interlaced gas feed and removal passages are implemented, then uniform gas distribution is achieved, but device complexity increases
Solution Approach 1:
The gas distribution plate integrates multiple functions into a single component: gas supply channels, exhaust openings, and structural support all in one plate. This multi-functionality reduces the need for separate components while achieving uniform gas distribution, thereby managing complexity through functional integration rather than adding more parts.
Data Source
AI summary
Gas distribution modules comprising a housing with an upper plenum and a lower plenum are described. One of the upper plenum and lower plenum is in fluid communication with an inlet and the other is in fluid communication with an outlet. A plurality of upper passages connects the upper plenum to the bottom of the housing to allow a flow of gas to pass through and be isolated from the first plenum.