Interlaced Center-Tapped Inductor Layout for Higher Q and Density
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Solution Overview
Problem
Existing inductors, such as symmetric inductors, face challenges in achieving high inductance density and resonate frequency, limiting their application ranges, and often require complex structural designs to access center-tapped terminals.
Innovation Solution
The inductor device features interlaced first and second sub-wires with connectors that allow direct access to center-tapped terminals from the outer side, facilitating structural symmetry and higher current tolerance without occupying additional layers, using a combination of sub-wires and connectors to enhance Q value and inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a symmetric inductor structure is used, then structural symmetry is improved, but inductance density and resonate frequency are reduced
Solution Approach 1:
The inductor is divided into multiple sub-wires (first sub-wires and second sub-wires) that are interlaced with each other. This segmentation allows the structure to maintain symmetry while increasing the effective winding density, thereby resolving the contradiction between structural symmetry and inductance density.
Solution Approach 2:
The patent utilizes vertical stacking of sub-wires in multiple layers, transitioning from a planar two-dimensional arrangement to a three-dimensional interlaced structure. This dimensional change enables higher inductance density within the same footprint while preserving structural symmetry through balanced layer configuration.
2Ease of operation
If center-tapped terminals are accessed using jumping methods, then terminal access is achieved, but additional layers are occupied and structural complexity increases
Solution Approach 1:
The center-tapped terminals are extracted and directly pulled out from the outer side of the inductor structure. This eliminates the need for complex jumping connections that would require additional layers, thereby reducing structural complexity while maintaining ease of terminal access.
Solution Approach 2:
Instead of accessing center-tapped terminals through the traditional method of jumping connections from the inner side, the patent inverts the approach by directly exposing terminals from the outer side. This reversal simplifies the structural design and reduces the number of layers required.
3Ease of manufacture
If conventional inductor structures are used, then manufacturing is simplified, but current handling capability is limited
Solution Approach 1:
Multiple sub-wires are combined in parallel to form the inductor structure, with center-tapped terminals directly accessible from the outer side. This merging of multiple current paths increases the overall current handling capability while maintaining a manufacturing process that is extensions of conventional techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves structural symmetry and quality factor (Q) while enabling direct access to center-tapped terminals, allowing for higher current handling and simplified structural design, thus expanding application ranges.
Implementation Method 1
The first sub-wires and the second sub-wires are disposed in an interlaced manner
Data Source
AI summary
An inductor device includes a first wire, a second wire, at least one first connector, at least one second connector, and a first center-tapped terminal. The first wire includes a plurality of first sub-wires. The second wire includes a plurality of second sub-wires. The first sub-wires and the second sub-wires are disposed in an interlaced manner. The at least one first connector couples the first sub-wire that is disposed on an outer side and the first sub-wire that is disposed on an inner side in the first sub-wires. The at least one second connector couples the second sub-wire that is disposed on the outer side and the second sub-wire that is disposed on the inner side in the second sub-wires. The first center-tapped terminal is coupled to the first sub-wire that is disposed on the outer side in the first sub-wires.