Interlaced VCSEL Module Layout for Uniform Substrate Heating
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Solution Overview
Problem
Current heat treatment apparatuses face challenges in achieving temperature uniformity and efficiency during the heat treatment of flat substrates, such as semiconductor wafers, due to limitations in temperature control and uniformity, which can lead to variations in the heat treatment process.
Innovation Solution
A substrate heat-treating apparatus using VCSEL technology, featuring a process chamber with an irradiation module comprising a device array plate and sub-irradiation modules arranged in a specific pattern to optimize laser beam irradiation, including a cooling block for efficient heat management and independent power supply to each sub-irradiation module, along with a rotating mechanism to enhance temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a conventional heat treatment apparatus uses a halogen lamp or flash lamp for rapid thermal processing, then the heating speed is fast, but the temperature uniformity across the substrate is poor
Solution Approach 1:
The irradiation module is divided into multiple sub-irradiation modules, each containing multiple VCSEL arrays. This segmentation allows independent control and optimization of each module's laser beam irradiation, enabling precise temperature uniformity control across different regions of the substrate while maintaining fast heating speeds.
Solution Approach 2:
Different regions of the substrate receive customized laser beam irradiation from VCSELs positioned at optimized locations. The system applies local quality control by adjusting the irradiation intensity and distribution in different areas to achieve uniform temperature across the entire substrate surface.
2Manufacturing precision
If VCSEL devices are arranged in a conventional configuration, then the device structure is simple, but the temperature uniformity and cooling efficiency are insufficient
Solution Approach 1:
The VCSEL devices are arranged in multiple sub-irradiation modules with device regions and terminal regions separated into distinct zones. This segmented arrangement optimizes both the irradiation pattern for temperature uniformity and the cooling pathways for heat dissipation, while maintaining a structured and manageable device architecture.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement of VCSELs in multiple layers and positions, creating optimized irradiation patterns from different angles and distances. This dimensional approach enhances temperature uniformity by distributing heat input across the substrate surface while providing multiple pathways for cooling.
3Productivity
If the irradiation module operates at high power for fast heating, then the productivity is high, but the device lifespan is reduced due to excessive heat accumulation
Solution Approach 1:
The cooling block is pre-positioned in direct thermal contact with the VCSEL devices before operation begins. This preliminary cooling arrangement ensures that heat is immediately dissipated during high-power operation, preventing heat accumulation that would reduce device lifespan while maintaining high heating efficiency for productivity.
Solution Approach 2:
The cooling block acts as an intermediary thermal management component between the high-power VCSEL devices and the heat sink. It efficiently transfers and dissipates the heat generated during high-power operation, protecting the VCSELs from thermal damage and extending their operational lifespan while maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves reduced temperature deviation and increased temperature uniformity across the substrate, extending the lifespan of the device module by optimizing the arrangement and power application of VCSEL devices, and allowing for efficient cooling and uniform heat distribution.
Implementation Method 1
a substrate heat-treating apparatus using VCSEL, which heats and heat-treats a flat substrate, such as a semiconductor wafer or a glass substrate, utilizing a laser irradiated from the VCSEL
Data Source
AI summary
The present disclosure discloses a substrate heat-treatment apparatus using a VCSEL element, the substrate heat-treatment apparatus comprising: a process chamber in which a flat plate substrate to be heat-treated is mounted; and an irradiation module for irradiating a laser beam onto the flat plate substrate, the irradiation module including a sub-irradiation module which includes an element array plate, an element area which is mounted on an upper surface of the element array plate and on which the VCSEL element is mounted, and a terminal area on which an electrode terminal is mounted and which is located at the front or rear side of the element area, wherein, in the irradiation module, the element area and the terminal area are respectively arranged in the x-axis direction, and the element area and the terminal area are alternately arranged along the y-axis direction perpendicular to the x-axis direction.