Interlayer Composition for Non-Polar Metal Nanoparticle Ink Adhesion
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Solution Overview
Problem
Existing metal nanoparticle inks, particularly non-polar silver nanoparticle inks, face issues with adhesion and mechanical robustness on substrates like glass and flexible plastics, leading to reduced print quality and conductivity, while current solutions compromise electrical conductivity for improved adhesion.
Innovation Solution
An interlayer composition comprising epoxy, polyvinyl phenol, a cross-linking agent, and epoxy silane, which provides film forming capability, adhesion to various substrates, and non-polar solvent-based ink wettability, enhancing print quality and conductivity without affecting the electrical properties of the nanoparticle inks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If non-polar metal nanoparticle inks are used, then ease of manufacture and cost are improved, but adhesion and print quality deteriorate
Solution Approach 1:
The patent introduces a surfactant as an intermediary substance between the non-polar metal nanoparticle ink and the substrate. The surfactant contains both polar and non-polar regions, allowing it to interact with both the non-polar ink and polar substrates, thereby improving adhesion without requiring changes to the ink formulation or substrate surface treatment.
Solution Approach 2:
The patent uses composite material structures, specifically combining surfactant molecules with amphiphilic properties (having both hydrophilic and hydrophobic regions) with the non-polar ink and substrate system. This composite approach allows the surfactant to bridge the interface between incompatible materials, improving adhesion while maintaining the benefits of non-polar inks.
2Strength
If adhesion promoters are added to improve adhesion, then adhesion strength is improved, but electrical conductivity deteriorates
Solution Approach 1:
The patent applies local quality by using surfactants that concentrate at the interface between the ink and substrate, providing adhesion promotion only where needed (at the interface) while leaving the bulk ink properties unchanged. This localized action allows adhesion improvement without affecting the electrical conductivity of the conductive features.
Solution Approach 2:
The surfactant acts as an intermediary that provides adhesion at the interface without becoming part of the conductive path. By positioning the surfactant at the ink-substrate interface rather than mixing it throughout the ink, the patent achieves adhesion improvement while maintaining the electrical conductivity of the metal nanoparticle network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interlayer composition significantly improves adhesion and print quality of non-polar metal nanoparticle inks on diverse substrates, maintaining high conductivity and flexibility, suitable for electronic device applications without requiring additional surface treatments.
Implementation Method 1
an epoxy silane
Implementation Method 2
a cross-linking agent
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
A composition formed from ingredients comprising: an epoxy; a polyvinyl phenol; a cross-linking agent; an epoxy silane; and a solvent is disclosed. A printable medium and other devices made from the composition are also disclosed.