Thermally Conductive Interlayer Filler for 3D IC Heat Dissipation
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Solution Overview
Problem
Three-dimensional integrated circuits face challenges with heat dissipation due to the low thermal conductivity of interlayer filler compositions, which can lead to performance degradation, and existing solutions struggle to balance thermal conductivity with bonding and process compatibility.
Innovation Solution
A composition combining a high thermal conductivity epoxy resin with a fine inorganic filler and a flux, where the epoxy resin has a specific melt viscosity and thermal conductivity, and the flux is incorporated to enhance bonding and prevent corrosion, allowing for efficient heat dissipation and secure electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional interlayer filler composition is used for lamination of semiconductor device chips, then the bonding process is simple, but the coefficient of thermal conductivity is very low causing heat accumulation and performance degradation
Solution Approach 1:
The patent uses a composite material system consisting of epoxy resin combined with highly thermally conductive inorganic fillers (boron nitride and aluminum nitride) to achieve high thermal conductivity while maintaining bonding reliability. The specific combination of organic resin matrix with inorganic filler particles creates a composite that dissipates heat effectively without compromising the lamination process
Solution Approach 2:
The patent optimizes the particle size distribution of inorganic fillers, specifying that 50% by volume consists of particles with 0.5 μm or smaller diameter. This parameter change in filler size distribution enables effective heat conduction pathways while maintaining proper flow and bonding characteristics during the lamination process
2Temperature
If highly thermally conductive inorganic filler is added to improve thermal conductivity, then heat dissipation improves, but resin peeling on filler surface occurs and desired thermal conductivity is not achieved
Solution Approach 1:
The patent specifies precise particle size parameters for the inorganic fillers, with 50% by volume being 0.5 μm or smaller. This size parameter optimization prevents resin peeling by ensuring adequate resin coverage and bonding surface area, while the small particle size maintains effective thermal conduction pathways
Solution Approach 2:
The patent employs a composite formulation combining epoxy resin with specific ratios of boron nitride and aluminum nitride fillers. This composite approach ensures good interfacial adhesion between resin and filler surfaces, preventing peeling while achieving the desired thermal conductivity through the synergistic combination of materials
3Temperature
If epoxy resin with high thermal conductivity is used, then thermal conductivity improves, but bonding properties and process compatibility deteriorate
Solution Approach 1:
The patent controls the melt viscosity of the epoxy resin within a specific range (10-1000 Pa·s at 120°C) to ensure both high thermal conductivity and proper process compatibility. This viscosity parameter optimization allows the resin to flow adequately during lamination while maintaining thermal performance
Solution Approach 2:
The patent specifies the glass transition temperature of the epoxy resin should be 80°C or higher, which maintains structural integrity during processing while allowing adequate thermal conductivity. This temperature parameter balance ensures both manufacturability and thermal performance
4Temperature
If inorganic filler is added to liquid resin for filling space between substrates, then thermal conductivity improves, but resin peeling on filler surface occurs
Solution Approach 1:
The patent optimizes the particle size distribution of inorganic fillers, with 50% by volume being 0.5 μm or smaller. This size parameter control prevents composition instability and resin peeling by ensuring adequate resin-to-filler surface area ratio, while maintaining effective thermal conduction
Solution Approach 2:
The patent uses a composite system of epoxy resin with boron nitride and aluminum nitride fillers in specific proportions. This composite formulation ensures composition stability by preventing resin peeling through proper interfacial adhesion, while achieving high thermal conductivity through the inorganic filler network
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a highly thermally conductive interlayer filler composition that effectively dissipates heat while maintaining strong bonding and electrical connectivity between semiconductor chips, addressing the limitations of previous technologies.
Implementation Method 1
a commonly very low coefficient of thermal conductivity of an interlayer filler composition to be used for lamination of semiconductor device chips
Implementation Method 2
the flux is required to have properties to remove the surface oxide film on the metal electric signal terminals such as solder bumps and the lands
Implementation Method 3
electric signal terminals such as solder bumps and are bonded by a filling interlayer formed by being filled with an interlayer filler composition
Data Source
AI summary
To provide an interlayer filler composition which, in 3D lamination of semiconductor device chips, forms a highly thermally conductive filling interlayer simultaneously with the bonding of solder bumps or the like and lands between semiconductor device chips, a coating fluid and a process for producing a three-dimensional integrated circuit. An interlayer filler composition for a three-dimensional integrated circuit, which comprises a resin (A) having a melt viscosity at 120°C of at most 100 Pa·s and a flux (B), the content of the flux (B) being at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A), or comprises a resin (A) having a melt viscosity at 120°C of at most 100 Pa·s and a coefficient of thermal conductivity of at least 0.2 W/mK, an inorganic filler (C) having a coefficient of thermal conductivity of at least 2 W/mK, a volume average particle size of at least 0.1 µm and at most 5 µm and a maximum volume particle size of at most 10 µm, and a curing agent (D) and/or a flux (B).