Interlayer Insulating Film Composition Using Composite Elastomer
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Solution Overview
Problem
Existing interlayer insulating films used in semiconductor devices lack improved mechanical properties, specifically fracture elongation while maintaining tensile strength, due to limitations in materials like photosensitive polyimide and polybenzoxazole resins.
Innovation Solution
A composition comprising a polymerizable monomer, an alkali-soluble elastomer with a polymerizable group, and an imide compound represented by a specific general formula, which is polymerized and then cured to form an interlayer insulating film with enhanced mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photosensitive polyimide or polybenzoxazole resin is used to form interlayer insulating film, then heat resistance and insulation resistance are improved, but mechanical properties (fracture elongation) deteriorate
Solution Approach 1:
The patent uses a composite material system consisting of polyimide resin as the base material and rubber particles as dispersed phase. This composite structure combines the heat resistance of polyimide with the mechanical flexibility of rubber, resolving the contradiction between heat resistance and mechanical properties. The rubber particles act as stress concentration points that prevent crack propagation, improving fracture elongation while maintaining the thermal stability of polyimide.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the polyimide resin by controlling the particle size, concentration, and distribution of rubber particles. By optimizing these parameters, the film achieves both high heat resistance (inheriting from polyimide) and improved mechanical properties (enhanced by rubber particle reinforcement), thus resolving the performance contradiction.
2Ease of operation
If photosensitive acrylic resin is used to form interlayer insulating film, then handleability and heat resistance are improved, but mechanical properties (fracture elongation) remain insufficient
Solution Approach 1:
The patent creates a composite film by dispersing rubber particles within the acrylic resin matrix. This composite structure provides both the ease of handling characteristic of acrylic resin and the mechanical strength from rubber particle reinforcement, resolving the contradiction between handleability and mechanical properties.
Solution Approach 2:
The patent introduces rubber particles with specific local properties (high elasticity, stress absorption) into the acrylic resin matrix. These localized rubber regions act as reinforcement points that improve overall mechanical properties while the bulk acrylic resin maintains good handleability, thus resolving the contradiction between ease of operation and mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves significantly improved fracture elongation while maintaining tensile strength, addressing the limitations of existing materials by forming a film with improved mechanical properties suitable for semiconductor devices.
Implementation Method 1
containing a polymerizable monomer (M), an alkali-soluble elastomer (P) containing a polymerizable group, an imide compound (Z), and a polymerization initiator
Data Source
AI summary
A composition for forming an interlayer insulating film including a polymerizable monomer, an alkali-soluble elastomer containing a polymerizable group, an imide compound represented by general formula (z-1), and a polymerization initiator, an interlayer insulating film containing a polymerized product thereof, a method for forming an interlayer insulating film pattern, and a device including the interlayer insulating film on a support. In the formula (z-1), R1 and R2 represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, Rz00 represents a divalent organic group containing an aliphatic hydrocarbon group and/or an aromatic hydrocarbon group, Rz01 and Rz02 represent an alkyl group or an alkoxy group, and n1 and n2 are 0 or 1.