Interlayer Insulating Film Composition Reducing Curing Temperature
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Solution Overview
Problem
Existing interlayer insulating films require high reaction temperatures and have limited mechanical properties, particularly fracture elongation, which hinders their performance in semiconductor devices.
Innovation Solution
A composition comprising a polymerizable monomer, an imide compound, a reaction promoter, and a polymerization initiator, which reduces reaction temperature and enhances mechanical properties like fracture elongation when used to form an interlayer insulating film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photosensitive PI or PBO is used to form interlayer insulating film, then heat resistance and insulation resistance are improved, but reaction temperature must be high (350°C to 400°C) and mechanical properties are limited
Solution Approach 1:
The patent changes the chemical composition parameters by introducing a specific imide compound with formula (z-1) containing divalent organic groups with aliphatic and/or aromatic hydrocarbon groups, along with specific polymerizable monomers and reaction promoters, to reduce the curing temperature from 350-400°C to a lower temperature range while maintaining film formation quality
Solution Approach 2:
The patent creates a composite material system combining polymerizable monomer (M), imide compound (Z), reaction promoter (A), and polymerization initiator, where each component contributes specific properties: the monomer provides polymerization capability, the imide compound provides heat resistance and mechanical properties, the reaction promoter accelerates the reaction, and the initiator triggers polymerization, achieving synergistic effects that reduce curing temperature while improving fracture elongation
2Ease of operation
If photosensitive acrylic resin is used to form interlayer insulating film, then handleability and heat resistance are improved, but mechanical properties (fracture elongation) are insufficient
Solution Approach 1:
The patent combines polymerizable monomer (M) which provides good handleability and processability, with imide compound (Z) which provides enhanced mechanical strength and fracture elongation, creating a composite system where the polymerizable monomer ensures ease of coating and handling while the imide compound structure contributes to superior mechanical properties after curing
Solution Approach 2:
The patent optimizes the local chemical structure by specifying that R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and Rz00 represents a divalent organic group containing specific hydrocarbon groups, creating localized structural features that enhance fracture elongation while maintaining overall film handleability
3Manufacturing precision
If high reaction temperature is used to form interlayer insulating film, then film formation is achieved, but mechanical properties and fracture elongation are limited
Solution Approach 1:
The patent changes the reaction temperature parameter from high temperature (350-400°C) to a lower temperature range by introducing the imide compound (Z) with specific chemical structure and combining it with reaction promoter (A), which enables complete polymerization and film formation at reduced temperatures while simultaneously improving fracture elongation and mechanical properties
Solution Approach 2:
The reaction promoter (A) acts as an intermediary substance that facilitates the polymerization reaction between the polymerizable monomer (M) and imide compound (Z) at lower temperatures, enabling the reaction to proceed efficiently without requiring high thermal energy input, thus preserving mechanical properties and enhancing fracture elongation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for the formation of interlayer insulating films with significantly improved fracture elongation and mechanical properties at lower curing temperatures, suitable for advanced semiconductor devices.
Implementation Method 1
a reaction promoter (A) which promotes the polymerization of the polymerizable monomer (M) and the imide compound (Z), and a polymerization initiator
Implementation Method 2
a reaction promoter (A) which promotes the polymerization of the polymerizable monomer (M) and the imide compound (Z)
Implementation Method 3
a step (iv) of curing the pre-pattern with heat to obtain an interlayer insulating film pattern
Data Source
AI summary
A composition for forming an interlayer insulating film including a polymerizable monomer, an imide compound represented by general formula (z-1), a reaction promoter which promotes the polymerization of the polymerizable monomer and the imide compound, and a polymerization initiator, an interlayer insulating film containing a polymerized product thereof, a method for forming an interlayer insulating film pattern, and a device including the interlayer insulating film on a support. In the formula (z-1), R1 and R2 represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. Rz00 represents a divalent organic group containing an aliphatic hydrocarbon group and/or an aromatic hydrocarbon group, Rz01 and Rz02 represent an alkyl group or an alkoxy group, and n1 and n2 are 0 or 1.