Interlayer Insulating Material Adhesion and Roughness Control
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Solution Overview
Problem
Conventional resin compositions used in multilayer printed wiring boards often result in insufficient adhesion between insulating layers and metal layers, leading to peeling issues and increased surface roughness.
Innovation Solution
An interlayer insulating material comprising an epoxy compound, a curing agent, silica, and a polyimide reactant of tetracarboxylic anhydride and dimer acid diamine, with a silica content of 30% to 90% and a total epoxy compound and curing agent content of 65% or more, enhancing adhesion and reducing surface roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional resin composition is used to form insulating layer, then manufacturing process is simple, but adhesion between insulating layer and metal layer is insufficient
Solution Approach 1:
The patent uses a composite resin composition containing epoxy resin, polyimide resin, and specific curing agents. This composite material approach combines the advantages of different resins to achieve both high adhesion strength and controlled surface properties, resolving the contradiction between strength improvement and composition complexity.
Solution Approach 2:
The patent specifies precise compositional parameters: epoxy resin content of 70-90 parts by weight, polyimide resin of 10-30 parts by weight, and specific curing agent ratios. By controlling these parameters within defined ranges, the invention achieves optimal adhesion while maintaining manufacturability.
2Manufacturing precision
If conventional resin composition is used, then material cost is low, but surface roughness increases
Solution Approach 1:
The patent controls surface roughness by adjusting the polyimide resin content to 10-30 parts by weight and specifying the curing agent type and ratio. These parameter changes smooth the insulating layer surface while using cost-effective conventional materials.
Solution Approach 2:
The patent differentiates the properties of different components: the epoxy resin provides bulk strength, the polyimide resin controls surface quality, and the curing agent enables crosslinking. This local quality differentiation allows surface roughness control without compromising overall material performance or cost-effectiveness.
3Strength
If silica content is increased to improve mechanical properties, then adhesion may improve, but surface roughness increases
Solution Approach 1:
The patent balances silica content with polyimide resin content to achieve both adhesion improvement and surface smoothness. The specific ratio of these components allows silica to provide reinforcement and adhesion while the polyimide resin fills gaps and smooths the surface.
Solution Approach 2:
The patent creates a multi-phase composite material system where silica particles are dispersed in the resin matrix. This composite structure allows the silica to provide mechanical reinforcement and adhesion enhancement while the resin matrix maintains surface smoothness and fills voids.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution significantly improves adhesion between insulating and metal layers, reduces surface roughness, lowers dielectric loss tangent, and enhances storage stability and uniformity of the insulating layer, while maintaining thermal dimensional stability.
Implementation Method 1
the polyimide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine
Implementation Method 2
a resin composition containing a polyfunctional epoxy resin (A), a phenolic curing agent and/or an active ester-based curing agent (B)
Data Source
AI summary
Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.