Interleaved Array Antenna Elements for Broadband Performance
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Solution Overview
Problem
Existing broadband antenna designs for two-dimensional structures, such as aircraft vertical stabilizers, face challenges in achieving broad bandwidth and efficiency due to the need for precise edge coupling and thin substrates, leading to high production costs and suboptimal performance.
Innovation Solution
The design features interleaved or overlapping radiating conductors between dipole elements, increasing coupling capacitance and allowing for simpler, more producible structures with integrated power dividing circuitry, achieving an omni-directional radiation pattern and a usable bandwidth exceeding 30:1.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If edge coupling between dipole elements is used to achieve broadband performance in a two-dimensional structure, then coupling between elements is achieved, but the design requires extremely small gaps, very thin substrates, open center dipoles, and precision manufacturing techniques, leading to high production costs and complex manufacturing
Solution Approach 1:
The patent transitions from edge coupling (two-dimensional surface coupling) to interleaved overlapping configuration where radiating elements extend through the substrate thickness, utilizing the third dimension (z-axis) to achieve coupling. This allows larger gaps and thicker substrates while maintaining coupling effectiveness, eliminating the need for precision manufacturing of extremely small gaps and thin substrates.
Solution Approach 2:
The radiating elements are nested within or through the substrate structure, with elements from opposite sides interleaving and overlapping each other. This nesting approach allows the elements to be embedded in the substrate rather than requiring precise surface mounting, simplifying manufacturing while maintaining coupling performance.
2Manufacturing precision
If edge coupling with very thin substrates and extremely small gaps is used, then coupling between dipoles is achieved, but the manufacturing precision requirements increase and production becomes expensive
Solution Approach 1:
By utilizing the thickness dimension of the substrate, the patent allows radiating elements to overlap through the substrate rather than requiring precise edge-to-edge alignment on the surface. This dimensional transition relaxes manufacturing precision requirements for gap sizes while maintaining effective coupling.
3Reliability
If capacitive feed structures on the opposite side of the substrate are used with dipole elements, then broadband performance is achieved, but the structure complexity and production cost increase
Solution Approach 1:
The patent merges the radiating elements and feed structures into a unified interleaved configuration. The same conductive elements that form the radiating dipoles also serve as the capacitive coupling structures, eliminating the need for separate capacitive feed structures on the opposite side of the substrate and reducing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved coupling performance, reduced production costs, and enhanced antenna efficiency, enabling the handling of large RF power levels while maintaining a compact form factor.
Implementation Method 1
the arrangement increases the capacitance between the radiating conductors, thereby increasing the coupling
Data Source
AI summary
An antenna with tightly coupled elements is provided. The antenna includes a plurality of planar elements. Each element is connected to a signal line, and is coupled to at least one other element. The elements are arranged in one or more linear arrays. A first array of elements can be provided on a first plane, while a second array of elements can be provided on a second plane. Moreover, elements included in the first array can can at least partially overlap elements included in the second array. Alternatively, a single array of elements formed on a first plane can be provided, with coupling elements that are capacitively connected to one element, and directly, are electrically connected to an adjacent element.