Interleaved Card Riser Assembly for Compact Integration
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Solution Overview
Problem
Current card/riser connection assemblies in data centers consume excessive lateral space, limiting the integration of multiple adaptor cards within a 19-inch rack due to wide connector configurations, which restricts the packing density of functional components in compact spaces.
Innovation Solution
The design introduces a second riser card with vertically overlapping adaptor/riser card connections, reducing lateral space consumption by approximately 50% through the alignment of connectors on different vertical planes, allowing for the integration of two sets of opposing adaptor cards within a 19-inch rack.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional wide connector configurations are used for card/riser connections, then connector reliability is maintained, but lateral space consumption increases significantly
Solution Approach 1:
The patent transitions connector arrangements from a single lateral dimension to a three-dimensional configuration by stacking connectors at different vertical heights. Risers are positioned at varying vertical levels (e.g., first riser at height H1, second riser at height H2), allowing multiple connectors to occupy the same lateral footprint while maintaining electrical isolation and functional separation. This vertical dimensionality change reduces lateral space consumption while preserving connector reliability.
Solution Approach 2:
The patent implements a nested arrangement where adaptor cards and risers are stacked vertically within each other's lateral footprint. The first adaptor card nests with the first riser at one vertical level, while the second adaptor card nests with the second riser at a different vertical level. This nesting configuration allows multiple card/riser connections to be packed into a compact lateral space while maintaining proper electrical connections and signal integrity.
2Quantity of substance
If multiple adaptor cards are integrated into compact spaces, then packing density improves, but airflow resistance becomes unbalanced
Solution Approach 1:
The patent distributes adaptor cards and risers across multiple vertical levels rather than stacking them in a single plane. By positioning connectors at different heights (H1, H2, H3, etc.), the design creates vertical spacing that allows airflow to pass through gaps between stacked components. This three-dimensional arrangement maintains high packing density while restoring balanced airflow resistance across all adaptor cards, preventing thermal hotspots and improving cooling efficiency.
Data Source
AI summary
An apparatus is described. The apparatus includes a first riser card connected to a first card. The apparatus also includes a second riser card connected to a second card, wherein, the first card's connection to the first riser card and the second card's connection to the second riser card pass through a vertical plane runs parallel to respective surfaces of the first and second riser cards.