Interleaved Cold Plate Fins for Targeted Computing Hotspot Cooling
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Solution Overview
Problem
Existing liquid cooling systems for computing systems face inefficiencies in manufacturing processes that hinder the ability to provide sufficient cooling for advanced computing components due to cost, lead-time, and physical limitations, resulting in inadequate heat dissipation capabilities.
Innovation Solution
The integration of fins on both a top and bottom plate of a cold plate, with varying densities and configurations, bonded using methods like diffusion or friction bonding, to enhance heat absorption and dissipation, allowing targeted cooling of hotspots and optimizing fin density for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uniform fins are provided in cold plates using traditional manufacturing processes, then manufacturing simplicity is maintained, but cooling capacity is insufficient due to cost, lead-time, and physical limitations
Solution Approach 1:
The cold plate is divided into multiple sections with different fin densities. High fin density regions are placed in hotspot areas for maximum cooling, while lower fin density regions are used in areas with less heat generation. This segmentation allows the system to achieve high cooling capacity where needed without the constraints of traditional uniform manufacturing processes.
Solution Approach 2:
Different regions of the cold plate are given different fin densities based on local heat dissipation requirements. The patent applies varying fin densities to different zones of the cold plate, creating local quality variations that optimize cooling performance for specific hotspots while maintaining manufacturing feasibility.
2Reliability
If fin density is increased to enhance cooling capacity, then heat dissipation capability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple fin density patterns into a single cold plate structure. By merging high fin density regions with lower fin density regions in one integrated component, the system achieves enhanced cooling capacity without requiring multiple separate manufacturing processes or assembly steps.
Solution Approach 2:
The patent introduces spatial variation in fin density across the cold plate surface, adding a dimensional aspect to fin configuration. Instead of uniform fins throughout, the fin density varies across different zones, creating a gradient or patterned structure that optimizes cooling while managing manufacturing complexity.
3Ease of manufacture
If uniform fin distribution is used throughout the cold plate, then manufacturing is simplified, but targeted cooling of hotspots is not achieved
Solution Approach 1:
The cold plate is designed with different fin densities in different regions to match the thermal characteristics of the heat source. High fin density areas are positioned over hotspots to provide targeted cooling, while lower fin density areas are used in regions with less heat generation, optimizing both manufacturing and thermal performance.
Solution Approach 2:
The cold plate surface is segmented into multiple zones with different fin densities based on the heat distribution pattern of the computing component. This segmentation enables targeted cooling of hotspots while maintaining a structured approach that can be manufactured using modified but feasible processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the cooling capacity of liquid cooling systems by increasing fin density and conductivity, enabling efficient thermal management of computing systems with varying heat distributions.
Implementation Method 1
liquid cooling systems which include cold plates are often used to cool computing systems
Implementation Method 2
liquid cooling systems which include cold plates are often used to cool computing systems
Implementation Method 3
Cold plates that are part of liquid cooling systems may include fins that are arranged to provide areas for heat dissipation within the cold plates
Data Source
AI summary
In one embodiment, an apparatus includes a first plate having a first plurality of fins integrally formed thereon and a second plate having a second plurality of fins integrally formed therein. The first plurality of fins is arranged to have a first fin density, and the second plurality of fins is arranged to have a second fin density. When the first plate and the second plate are assembled together, the first plurality of fins and the second plurality of fins are interleaved to form a first fin array, the first fin array having a third fin density.