Interleaved-Dielectric Joining for Multi-Layer PCB Expansion
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Solution Overview
Problem
Current manufacturing limitations of printed circuit board (PCB) panel sizes restrict the performance density within rack structures due to the need for multiple connectors and cables, leading to inefficiencies in both power delivery and signal transmission.
Innovation Solution
The method of interleaved-dielectric joining of multi-layer laminates involves interweaving dielectric layers and applying heat and pressure to create a larger laminate, optionally using pre-impregnated composite fibers and ultrasonic welding or plated through holes to connect conductors, allowing for increased panel size without mechanical failure points or electrical parasitics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If standard PCB panel sizes are used, then manufacturing is easier and equipment compatibility is maintained, but performance density within rack structures is limited due to the need for multiple connectors and cables
Solution Approach 1:
Multiple separate PCB panels are merged into a single large-format PCB through direct lamination of dielectric layers and conductor connection, eliminating the need for connectors and cables between panels. This combines multiple functional units into one integrated structure, increasing performance density while reducing component count.
Solution Approach 2:
The invention transitions from standard two-dimensional PCB panel sizes to a larger effective area by stacking and laminating multiple dielectric layers with embedded conductors. This dimensional approach allows creating a large-format PCB that exceeds conventional panel size limitations while maintaining manufacturing feasibility.
2Adaptability or versatility
If connectors and cables are used to connect multiple backplanes, then system expandability is achieved, but signal latency and electrical parasitics increase
Solution Approach 1:
Multiple backplane functions are merged into a single large-format PCB structure, eliminating external connectors and cables. This integration removes electrical parasitics and signal latency associated with connector interfaces while maintaining the ability to expand system functionality through additional PCB layers and integrated components.
3Power
If power cables and connectors are used to deliver power to large backplanes, then power delivery is achieved, but PCB real estate is consumed and complexity increases
Solution Approach 1:
Power delivery functionality is merged directly into the PCB structure through integrated power traces and planes embedded within the laminated dielectric layers. This eliminates the need for separate power cables and connectors, freeing up PCB real estate for compute components while reducing assembly complexity.
4Manufacturing precision
If sequential lamination is used to create high-layer-count boards, then via stub control and wireability are improved, but panel size expansion is not achieved
Solution Approach 1:
The invention combines sequential lamination techniques with direct panel stacking and lamination methods. Multiple high-layer-count PCB subassemblies are laminated together to create an even larger format PCB, achieving both via stub control through controlled lamination processes and panel size expansion beyond standard limitations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of larger, more efficient PCBs with improved performance density by eliminating the need for lossy connectors and cables, enhancing power delivery and signal transmission while maintaining standard manufacturing equipment compatibility.
Implementation Method 1
The unlaminated portions are laminated together with heat and pressure, to create a larger laminate of the joined first and second multi-layer laminates
Implementation Method 2
The unlaminated portions are laminated together with heat and pressure, to create a larger laminate of the joined first and second multi-layer laminates
Implementation Method 3
ultrasonic welding (USW) optionally is used for connecting a plurality of shapes carried by adjacent dielectric layers, such as the conductors carried by adjacent dielectric layers
Data Source
AI summary
A method and apparatus are provided for implementing interleaved-dielectric joining of multi-layer laminates. First and second multi-layer laminates are provided, each having with a laminated portion and an unlaminated portion. The first and second multi-layer laminates are joined together at the unlaminated portions by interleaving a plurality of dielectric layers of the first and second multi-layer laminates. Respective conductors carried by adjacent dielectric layers are connected. The interleaved unlaminated portions are laminated together with heat and pressure, to create a larger laminate of the joined first and second multi-layer laminates.