Interleaved Manifold Cooling for High Power Density Electronics
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Solution Overview
Problem
Traditional air cooling methods are inadequate for high power density electronic devices, leading to thermal management challenges, as they are limited in extracting heat effectively and often require larger footprints, which is not suitable for densely packed circuits.
Innovation Solution
A cooling apparatus with an integrated manifold structure featuring interleaved inlet and outlet passageways that inject and exhaust coolant perpendicular to the surface to be cooled, minimizing footprint and reducing pressure drop, especially in two-phase designs, allowing immediate coolant exit and uniform heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air cooling methods are used, then the cooling apparatus footprint can be minimized, but heat extraction effectiveness deteriorates and cannot meet high power density requirements
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a coolant flow system with inlet and outlet passageways. The liquid coolant directly contacts the heated surface through the manifold structure, enabling much higher heat extraction effectiveness and power density handling compared to air cooling methods.
Solution Approach 2:
The patent introduces a third dimension by using vertical passageways that extend through the thickness of the heated component. Coolant flows through passageways in the +z direction to cool surfaces, and returns through interleaved passageways in the -z direction, creating a three-dimensional cooling architecture that significantly enhances cooling capacity per unit footprint area.
2Ease of manufacture
If coolant inlet and outlet passageways are separated in the manifold structure, then manufacturing is simplified, but apparatus footprint increases and pressure drop increases
Solution Approach 1:
The patent combines the coolant inlet and outlet passageways into a single integrated manifold structure. The interleaved arrangement of inlet and outlet passageways within the same manifold body reduces the overall footprint by eliminating the need for separate inlet and outlet manifolds, while maintaining effective coolant flow paths.
Solution Approach 2:
The patent utilizes the vertical dimension (z-direction) to interleave inlet and outlet passageways at different heights within the manifold structure. This three-dimensional arrangement allows both inlet and outlet ports to be accessed from the same edge of the heated surface, minimizing the horizontal footprint while maintaining separate flow paths.
3Device complexity
If coolant passageways are arranged in a conventional non-interleaved manner, then flow path design is simplified, but pressure drop increases especially in two-phase designs
Solution Approach 1:
The patent arranges inlet and outlet passageways in alternating interleaved positions both horizontally and vertically. The inlet passageways extend in the +z direction while outlet passageways extend in the -z direction, creating a three-dimensional interleaved pattern that balances flow distribution and minimizes pressure drop by reducing flow path length and improving two-phase flow characteristics.
Solution Approach 2:
The patent divides the manifold structure into alternating segments of inlet passageways and outlet passageways. This segmentation creates multiple independent flow channels that can be optimized individually, reducing overall pressure drop by distributing flow across multiple parallel paths and improving coolant distribution uniformity.
4Stress or pressure
If coolant flows parallel to the surface to be cooled, then pressure drop is reduced, but heat transfer efficiency decreases and vapor build-up occurs
Solution Approach 1:
The patent transitions from parallel flow (in-plane) to perpendicular flow (out-of-plane) by directing coolant through passageways that extend in the z-direction, perpendicular to the heated surface. This vertical flow configuration maintains low pressure drop while dramatically improving heat transfer efficiency through direct impingement on the heated surfaces and preventing vapor build-up by enabling immediate coolant exit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages high heat flux in electronic devices by minimizing the cooling apparatus footprint, reducing pressure drop, and preventing vapor build-up, thereby enhancing thermal management and heat transfer efficiency.
Implementation Method 1
a manifold structure having a plurality of inlet passageways for injecting coolant onto a surface to be cooled
Implementation Method 2
Coolant passes through the plurality of inlet passageways from the coolant inlet plenum in a first direction perpendicular to the surface to be cooled
Implementation Method 3
a plurality of outlet passageways for exhausting coolant after impinging on the surface to be cooled. Coolant passes through the plurality of outlet passageways to the coolant outlet plenum in a second direction perpendicular to the surface to be cooled, wherein the first and second directions are opposite directions
Implementation Method 4
the manifold structure, including the coolant inlet plenum and coolant outlet plenum, is contained within a rectangular volume defined by a projection of the common edge
Data Source
AI summary
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from an electronic device. The cooling apparatus includes a manifold structure having a plurality of inlet and outlet passageways for injecting coolant onto, and exhausting coolant after impinging on, a surface to be cooled. The coolant inlet and outlet passageways are interleaved in the manifold structure, and coolant is injected and exhausted through a common edge of the manifold. The manifold structure further includes coolant inlet and outlet plenums, with coolant passing through the inlet passageways from the inlet plenum in a first direction and coolant passing through the outlet passageways to the outlet plenum in a second direction, the first and second directions being perpendicular to the surface to be cooled and being opposite directions, and wherein the manifold structure is contained within a rectangular volume defined by a projection of the common edge.