Interleaved PCB Wiring Reduces Impedance
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Solution Overview
Problem
The increasing need for lower characteristic impedances in wiring patterns of suspension boards used in hard disk drives, due to improved recording densities and the introduction of Perpendicular Magnetic Recording systems, is not effectively addressed by existing technologies.
Innovation Solution
A printed circuit board design featuring insulating layers with specific wiring patterns and connecting layers, where the wiring patterns are arranged such that one line is between the other lines, increasing capacitance and reducing characteristic impedances, and the connecting layers are formed from the metal layer to enhance capacitance and simplify manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If wiring patterns are arranged with lines interleaved and intersection regions are created, then capacitance increases and characteristic impedance decreases, but device complexity increases
Solution Approach 1:
The patent utilizes three-dimensional space by creating intersection regions where wiring patterns from different layers cross each other. This dimensional approach allows lines to be positioned between other lines through vertical stacking, increasing capacitance without requiring excessive lateral space or planar complexity.
Solution Approach 2:
The wiring patterns are arranged in a nested configuration where first and second lines from the first wiring pattern are positioned between third and fourth lines of the second wiring pattern in intersection regions. This nesting increases the effective capacitance area while maintaining a compact structure.
2Quantity of substance
If larger currents are used for writing in PMR systems, then recording density improves, but characteristic impedance of wiring patterns increases causing transmission loss
Solution Approach 1:
The patent changes the electrical parameters of the wiring patterns by increasing capacitance through the interleaved line arrangement and intersection regions. This capacitance increase directly reduces characteristic impedance, enabling larger writing currents to be transmitted with reduced loss to the magnetic head.
3Reliability
If wiring patterns are designed with reduced characteristic impedance, then transmission characteristics improve, but manufacturing complexity increases
Solution Approach 1:
The patent divides the wiring pattern design into distinct segments: first and second lines forming a first wiring pattern, and third and fourth lines forming a second wiring pattern. This segmentation allows each pattern to be manufactured independently using standard PCB techniques, then combined through the insulating layer to create the low-impedance structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the characteristic impedances of the wiring patterns, improving transmission characteristics and reducing transmission loss while maintaining a simple and cost-effective manufacturing process.
Implementation Method 1
the first and second lines of the first wiring pattern and the third and fourth lines of the second wiring pattern are arranged such that any one of the first and second lines is located between the third and fourth lines and any one of the third and fourth lines is located between the first and second lines
Data Source
AI summary
A printed circuit board and method of manufacturing the printed circuit board, including a first and a second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of the second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.