Interleaved PFC Heat Sink for Switching Regulator Thermal Management
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Solution Overview
Problem
Interleaved PFC circuits in switching regulators face challenges in size reduction and heat dissipation, leading to increased temperature and noise interference, as the close mounting of components compromises heat dissipation and creates dead spaces on the circuit board.
Innovation Solution
A switching regulator design featuring a heat sink with multiple dissipation portions and strategically placed openings to optimize component mounting and heat dissipation, allowing for efficient use of circuit board space while shielding radiation noise from inductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are mounted closely to reduce size, then circuit board space is reduced, but heat dissipation is compromised and temperature increases
Solution Approach 1:
The heat sink utilizes three-dimensional space by extending vertically from the circuit board with multiple heat dissipation portions at different heights and positions. The first heat dissipation portion extends in a first direction, the second in a second direction, and the third in a third direction, creating a multi-dimensional heat dissipation structure that occupies vertical and lateral space efficiently while maintaining close component mounting on the circuit board.
Solution Approach 2:
The heat sink is divided into multiple separate heat dissipation portions (first, second, and third portions) that can be positioned at different locations and orientations. This segmentation allows each portion to serve specific components while collectively providing comprehensive heat dissipation across the circuit board, enabling close component placement without thermal interference.
2Loss of energy
If heat sink area is increased to improve heat dissipation, then component mounting area is reduced, but component placement flexibility is compromised
Solution Approach 1:
The heat sink transitions from a two-dimensional planar structure to a three-dimensional structure with portions extending in multiple directions (first, second, and third directions). This vertical and multi-directional extension provides large heat dissipation surface area without occupying excessive circuit board mounting area, as the heat dissipation surfaces extend upward and laterally rather than spreading across the board plane.
Solution Approach 2:
Different heat dissipation portions are strategically positioned to serve specific components: the first heat dissipation portion serves certain components, the second serves others, and the third fills gaps between components. This localized heat dissipation approach maximizes heat dissipation efficiency while minimizing interference with component mounting areas.
3Object-affected harmful factors
If components are placed closer to reduce noise interference, then heat dissipation performance deteriorates, but radiation noise increases
Solution Approach 1:
The heat sink acts as an intermediary structure between components that generates radiation noise and other circuit components. By positioning heat dissipation portions between components, the heat sink serves as a physical barrier that shields against radiation noise while simultaneously providing heat dissipation pathways, thus addressing both noise and thermal issues concurrently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively utilizes circuit board space for component mounting without compromising heat dissipation, reduces radiation noise, and allows for closer component placement, thereby improving reliability and reducing the risk of temperature breakdown.
Implementation Method 1
a heat sink having a first heat dissipation portion and a second heat dissipation portion, each in a rectangular shape, facing each other along a prescribed length at a prescribed distance from each other
Implementation Method 2
Heat sink 1 is comprised of a circuit component installation portion 3 and a fin 2... Heat sink 1 is mounted with a surface of fin 2 on circuit board 4
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
A heat sink (11) comprised of a first heat dissipation portion (11a), a second heat dissipation portion (11b), and a third heat dissipation portion (11c) is mounted on a circuit board (14). Two sets of an inductor (L1, L2) that constitute an interleaved power factor correction circuit are arranged in a spatial region formed in the inside of the heat sink and are mounted on the circuit board. Two sets of a transistor (Tr1, Tr2) and a diode (D1, D2) that constitute the interleaved power factor correction circuit are attached to an outer surface of the first heat dissipation portion and are mounted on the circuit board.