Interleaved Pick-and-Place Patterns for LED Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing pick-and-place apparatuses face challenges in achieving uniformity of component performance on substrates while maintaining high throughput, particularly due to non-uniformity in LED performance across wafers, which is exacerbated by serpentine processes and limited by robotic arms.
Innovation Solution
A pick-and-place apparatus that places components in multiple passes using interleaved placement patterns, optimizing the distribution of components across the substrate to improve uniformity while allowing high throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If components are placed using a serpentine process to maintain high throughput, then productivity is improved, but uniformity of component performance deteriorates
Solution Approach 1:
The placement process is divided into multiple passes, with each pass placing a subset of components according to a specific placement pattern. This segmentation allows the system to maintain high throughput while achieving uniform distribution of components across the substrate, resolving the contradiction between productivity and uniformity.
Solution Approach 2:
The system dynamically selects from multiple interleaved placement patterns based on the current pass number. By making the placement pattern dynamic rather than static, the system can adapt to achieve both high throughput and uniform component distribution, preventing the performance non-uniformity that occurs with fixed serpentine processes.
2Device complexity
If a single placement pattern is used to simplify the process, then device complexity is reduced, but uniformity of component performance deteriorates
Solution Approach 1:
The system employs periodic action by cycling through multiple placement patterns in a repeating sequence across different passes. This periodic variation in placement patterns ensures uniform component distribution while maintaining a relatively simple control mechanism that selects patterns based on the pass number, thus not significantly increasing device complexity.
Solution Approach 2:
The system changes the placement pattern parameter based on the pass number, creating interleaved patterns that improve uniformity. This parameter change approach achieves better uniformity without requiring complex additional hardware, as it primarily involves software-controlled pattern selection.
3Device complexity
If components are collected at a single collect position to simplify the apparatus, then device complexity is reduced, but productivity deteriorates
Solution Approach 1:
The collection process is segmented into multiple passes, with each pass collecting a subset of components from different positions on the carrier. This segmentation enables high throughput by parallelizing collection operations while using a relatively simple single collect position mechanism, avoiding the need for complex multi-position collection systems.
Solution Approach 2:
The system dynamically adjusts which components are collected in each pass based on the placement pattern being used. This dynamic coordination between collection and placement operations maintains high throughput while keeping the collection apparatus simple, as the single collect position is efficiently utilized across multiple passes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved uniformity of component performance on the substrate by spreading components evenly, enhancing user-perceived quality without compromising throughput.
Implementation Method 1
vacuum units 106 are mounted that are each configured for holding a component 107 by means of vacuum
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Aspects of the present disclosure relate to a pick-and-place apparatus that is configured to cause components to be placed on a substrate in a number of passes, wherein during each pass components among a plurality of components are placed on the substrate in a respective placement pattern among a collection of interleaved placement patterns.