Interleaved Pick-and-Place Patterns for Uniform Component Placement
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Solution Overview
Problem
Existing pick-and-place apparatuses struggle to achieve uniformity of component performance on substrates while maintaining high throughput, as non-uniform distributions from carriers are transferred to substrates during the pick-and-place process.
Innovation Solution
The apparatus employs a multi-pass method with interleaved placement patterns, where components are placed on the substrate in a series of passes using distinct patterns that spread components across the substrate, improving randomness and uniformity, and a pattern determination unit optimizes collect and placement patterns based on a wafer map to balance throughput and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single-pass pick-and-place method is used, then high throughput is achieved, but uniformity of component performance on substrate is poor
Solution Approach 1:
The pick-and-place process is divided into multiple passes, with each pass handling a subset of components according to a specific placement pattern. This segmentation allows the system to maintain high throughput while achieving uniform performance distribution by strategically selecting which components to place in each pass based on wafer map data.
Solution Approach 2:
The placement patterns are dynamically adjusted between passes to optimize both throughput and uniformity. The system adapts the collect and placement patterns based on real-time considerations of component performance characteristics from the wafer map, allowing flexible optimization without sacrificing productivity.
2Manufacturing precision
If multi-pass method with interleaved placement patterns is used, then uniformity of component performance is improved, but throughput may be reduced
Solution Approach 1:
Each pass places only a subset of the total components required for the substrate, using partial action to achieve the desired uniformity. By strategically selecting which components to place in each pass based on performance characteristics, the system achieves uniformity without requiring excessive passes that would reduce throughput.
Solution Approach 2:
The system employs periodic placement patterns that repeat across multiple passes, with each pattern designed to complement previous placements. This periodic approach ensures systematic coverage of the substrate while maintaining uniform performance distribution, balancing the trade-off between uniformity and throughput.
3Device complexity
If components are collected from fixed collect position and released at fixed release position, then apparatus complexity is reduced, but uniformity of placement is poor
Solution Approach 1:
While maintaining fixed collect and release positions to minimize apparatus complexity, the system dynamically changes the placement patterns between passes. This dynamic pattern adjustment allows uniform placement to be achieved without requiring complex movable collection or release mechanisms.
Solution Approach 2:
Different placement patterns are applied in different passes, with each pattern optimized for specific regions or subsets of components. This local quality approach ensures that components with similar performance characteristics are distributed uniformly across the substrate, achieving precision without increasing overall apparatus complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the uniformity of component performance on substrates while maintaining high throughput by spreading components evenly across the substrate, improving the randomness and uniformity of the placement, and allowing for adjustable trade-offs between throughput and uniformity based on specific applications.
Implementation Method 1
Vacuum units 106 are mounted that are each configured for holding a component 107 by means of vacuum
Data Source
AI summary
Aspects of the present disclosure relate to a pick-and-place apparatus that is configured to cause components to be placed on a substrate in a number of passes, and during each pass, components among a plurality of components are placed on the substrate in a respective placement pattern among a collection of interleaved placement patterns.