Interleaved Power Converter Layout for Space and Heat Constraints
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Solution Overview
Problem
Existing power supplies face challenges in optimizing space utilization, heat dissipation, and design flexibility due to complex internal conversion circuits, which affect the competitiveness and performance of electronic devices.
Innovation Solution
A power converter design featuring an in-line package configuration with parallel-connected power conversion circuits controlled by a unified controller, utilizing a circuit substrate to enhance space efficiency and modularization, and incorporating phase-interleaved signal control to reduce ripple and filter requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If power conversion circuits are arranged in traditional layouts, then circuit functionality is achieved, but space utilization is poor and heat dissipation is inefficient
Solution Approach 1:
The patent transitions from traditional planar 2D layout to a 3D vertical arrangement where power conversion circuits are stacked above the circuit substrate. This dimensional change enables better space utilization by utilizing the vertical dimension, and improves heat dissipation by exposing larger surface areas of the power conversion circuits to the ambient environment for thermal management.
Solution Approach 2:
The power supply is segmented into distinct functional modules: the circuit substrate containing control circuits, and multiple power conversion circuits arranged vertically above it. This segmentation allows independent optimization of each module's thermal and spatial characteristics, enabling the power conversion circuits to be positioned for both compact integration and effective heat dissipation.
2Adaptability or versatility
If complex internal conversion circuits are used, then power conversion functionality is achieved, but design flexibility and competitiveness are reduced
Solution Approach 1:
The circuit substrate is designed as a universal platform that can accommodate multiple different power conversion circuit configurations above it. The substrate provides standardized interfaces and control functionality, allowing the same substrate to support various power conversion topologies and specifications, thereby enhancing design flexibility without requiring complex custom circuits for each application.
3Area of stationary object
If power conversion circuits are closely integrated, then space efficiency is improved, but heat dissipation becomes more difficult
Solution Approach 1:
By arranging power conversion circuits vertically above the circuit substrate rather than spreading them out horizontally, the patent achieves high space efficiency in the horizontal plane while utilizing the vertical dimension for heat dissipation. The vertical arrangement exposes the sides and top surfaces of the power conversion circuits to ambient air flow, facilitating passive and active cooling mechanisms.
Data Source
AI summary
A power converter comprising a circuit substrate, a controller circuit, and multiple power conversion circuits is provided. The controller circuit is arranged on the circuit substrate. The multiple power conversion circuits are coupled to the controller circuit, and are arranged on the circuit substrate in an in-line package. The power conversion circuits are connected in parallel, and are configured to convert an input power into an output power. The controller circuit is configured to control multiple power switches in the power conversion circuits by multiple phase-interleaved signals so that the power conversion circuits generate the output power.