Interleaved Substrate Supply for Semiconductor Process Tools
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Solution Overview
Problem
In semiconductor manufacturing, conventional substrate handling techniques lead to inefficiencies due to fixed lot sizes and priorities, resulting in idle times and reduced tool utilization, especially when processing substrates of varying sizes and priorities.
Innovation Solution
Implementing an interleaved substrate supply method, where substrates from multiple carriers can be supplied to a process module based on priority and process conditions, allowing for dynamic interruption and resumption of jobs to optimize tool utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are supplied from multiple carriers in an interleaved manner based on priority, then tool utilization is improved and idle times are reduced, but job processing complexity and control system complexity increase
Solution Approach 1:
The system dynamically adjusts job processing by allowing interruptions and resumptions based on real-time priority assessments. The job management unit can interrupt a currently processed job when a higher priority job arrives, and resume the interrupted job later, making the processing system flexible and adaptive rather than rigid and sequential
Solution Approach 2:
The job management unit acts as an intermediary between the automated transport system and the process module. It receives process information, determines job priorities, makes interruption decisions, and coordinates the interleaved supply of substrates from multiple carriers, thereby managing the complexity centrally rather than distributing it throughout the system
2Ease of manufacture
If fixed lot sizes are used for substrate carriers, then manufacturing simplicity is maintained, but tool utilization efficiency deteriorates due to idle times when processing substrates of varying sizes
Solution Approach 1:
Instead of fixed lot sizes, the system dynamically adapts to varying substrate quantities in carriers. The job priority estimator and job management unit can handle carriers with different numbers of substrates (e.g., 25, 10, or 1 substrate) and adjust the processing sequence accordingly, allowing the system to efficiently process both full and partially depleted carriers without wasting tool time
Solution Approach 2:
The system performs preliminary assessment of carrier contents and job priorities before processing begins. The job priority estimator evaluates process information in advance to determine the optimal processing sequence, allowing the system to proactively prepare for varying lot sizes and minimize idle times by having substrates ready when the process module is available
Data Source
AI summary
By enabling an interleaved mode when supplying substrates from a plurality of load ports to a respective process module, a reduction of non-productive time of the process tool and/or a reduction of cycle time may be achieved compared to a conventional sequential processing of carriers. Upon arrival at a load port of the process tool, an appropriate priority may be assigned to the carrier, wherein a higher priority may enable the interruption of the processing of a lower-ranked substrate carrier.