Interlocked Heat Spreader Inserts for Complex Geometries

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional heat spreader manufacturing techniques, such as stamping from copper sheets, are limited by the thickness and geometry of the sheets, leading to costly and wasteful production, and can result in reduced thermal and mechanical performance due to deformation and recrystallization, especially in complex geometries.

Innovation Solution

The use of heat spreaders with interlocked inserts, where a frame made of a strong material like stainless steel or aluminum is combined with a thermally conductive insert, such as copper, allowing for interference fitting and deformation to create complex geometries with improved thermal management and mechanical robustness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional stamping from copper sheets is used, then manufacturing simplicity is maintained, but manufacturing precision and thermal performance deteriorate due to deformation and recrystallization

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidgeometric precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The heat spreader is divided into two separate components: a frame made from copper sheet and an insert made from rigid material. These segments are manufactured separately using different processes (stamping for the frame, precision machining or molding for the insert) and then assembled together through interference fitting, allowing each component to be optimized independently without the drawbacks of trying to stamp the entire complex geometry.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention uses a composite structure combining copper (for thermal conductivity) with a rigid material (for geometric precision and structural integrity). This composite approach allows the copper frame to provide thermal management while the rigid insert maintains precise complex geometries without deformation or recrystallization issues that plague conventional copper stamping.

Inventive Principle:
Principle #40Composite materials

2Shape

If copper sheet thickness is increased to achieve complex geometries, then geometric capability improves, but material cost and waste increase

Engineering Contradiction:
Improvegeometric capabilityVSAvoidmaterial waste
Core Design Contradiction:
ShapeVSLoss of substance

Solution Approach 1:

By segmenting the heat spreader into a copper frame and a separate rigid insert, the copper sheet can remain thin while the complex geometry is achieved through the precision-manufactured insert. This eliminates the need to use thick copper sheets that would be required to stamp complex geometries directly, thereby reducing copper material consumption and cost.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The copper is applied locally where thermal conductivity is needed (in the frame structure), while the rigid insert provides the complex geometry where structural precision is needed. This local differentiation of material properties optimizes material usage, allowing thin copper sheets to suffice rather than requiring thick sheets to achieve geometric complexity.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If conventional stamping is used, then manufacturing cost is reduced, but thermal performance deteriorates due to material deformation

Engineering Contradiction:
Improvemanufacturing costVSAvoidthermal performance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The composite structure uses copper for optimal thermal conductivity in the frame while employing a rigid material for the insert that maintains precise geometry without deformation. This combination achieves superior thermal performance compared to conventional copper stamping, while the manufacturing cost remains controlled through the simplicity of stamping the copper frame and using standard precision manufacturing for the insert.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention changes the material parameter of the insert from soft copper to rigid material, which fundamentally alters the thermal and mechanical performance. The rigid material maintains its geometric integrity without deformation during assembly and operation, ensuring consistent thermal performance, while the copper frame continues to provide excellent thermal conductivity through conventional cost-effective stamping.

Inventive Principle:
Principle #35Parameter changes

4Device complexity

If single-material heat spreaders are used, then structural simplicity is maintained, but adaptability deteriorates for different thermal and mechanical requirements

Engineering Contradiction:
Improvestructural simplicityVSAvoidmaterial selection flexibility
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

Segmenting the heat spreader into a copper frame and a replaceable rigid insert creates a modular structure. This segmentation maintains relative structural simplicity while dramatically increasing adaptability, as different insert materials can be selected and swapped based on specific application requirements for thermal conductivity, mechanical strength, or other properties, without redesigning the entire heat spreader structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The copper frame serves as a universal base structure that can accommodate different types of inserts with varying material properties. This universal design allows the same frame to be used across multiple applications with different thermal and mechanical requirements, simply by changing the insert material, thereby achieving high versatility without proportionally increasing structural complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of heat spreaders with complex geometries at lower costs, enhancing thermal management and mechanical integrity, suitable for powerful computing devices, while reducing material waste and improving overall computing device performance.

Implementation Method 1

deforming the insert around the projection such that the insert is in contact with the top surface, the side surface, and the bottom surface of the projection

Methodology Applied
Scientific EffectPlastic deformation: Plasticity

Implementation Method 2

allowing for interference fitting and deformation to create complex geometries with improved thermal management and mechanical robustness

Methodology Applied
Scientific EffectInterference fitting: Mechanical Force

Implementation Method 3

Heat spreaders may be used to move heat away from an active electronic component so that it can be more readily dissipated by a heat sink or other thermal management device

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10969840B2Heat spreaders with interlocked inserts
Publication Date: 2021.04.06 TAHOE RES LTD
  • US10969840B2 patent drawing
  • US10969840B2 patent drawing
  • US10969840B2 patent drawing

AI summary

Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.