Interlocked PCB Assembly for High-Density 3D Circuit Layouts
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) are dimensionally limited, restricting the high-density implementation of circuitry.
Innovation Solution
The use of interlocked multiple circuit boards, where each board has slots that interlock with corresponding slots on adjacent boards, creating a three-dimensional structure that allows for higher density circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional planar circuit board structures are used, then manufacturing simplicity is maintained, but circuit density is limited
Solution Approach 1:
The patent transitions from conventional two-dimensional planar circuit boards to a three-dimensional interlocked structure. Multiple circuit boards are stacked and interconnected vertically, allowing circuit traces to extend through multiple layers and planes. This dimensional expansion enables significantly higher circuit density without compromising manufacturing feasibility, as each board layer can be fabricated using standard planar processes before assembly.
Solution Approach 2:
The circuit board system is divided into multiple separate board layers that can be independently fabricated and then assembled through interlocking mechanisms. Each board layer contains specific circuit segments, and the interlocking structure provides electrical and mechanical connectivity between layers. This segmentation allows for modular manufacturing and assembly while achieving high overall circuit density.
2Productivity
If multiple circuit boards are interlocked to increase density, then circuit density is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines mechanical interlocking features with electrical connectivity functions into integrated structures. The interlocking mechanisms serve dual purposes: providing structural support for the multi-layer assembly and establishing electrical connections between board layers. This merging reduces the need for separate connectors and simplifies the overall assembly process despite the increased density.
Solution Approach 2:
The interlocking structure is designed to perform multiple functions simultaneously: mechanical support, electrical connectivity, and alignment guidance for assembly. This multi-functionality reduces the number of separate components needed and simplifies the manufacturing process, allowing the same structural features to serve multiple purposes in the high-density circuit board assembly.
Data Source
AI summary
A circuit board assembly may include a first circuit board including a first slot. The circuit board assembly may include a second circuit board. The first circuit board may be interlocked with the second circuit board via interlocking provided by the second circuit board into the first slot.