Interlocking Case Assembly for Electronic Devices
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Solution Overview
Problem
Conventional case assembly structures for electronic devices suffer from insufficient creepage distance and bonding strength, leading to potential electric leakage and structural fragility, particularly under impact.
Innovation Solution
The case assembly structure features a first case with a first connection portion including a first protrusion, a first trench, and a second protrusion, and a second case with a second connection portion comprising a third protrusion and a second trench, where the second case is inserted into the entrance of the first case, allowing for increased creepage distance and enhanced bonding strength through ultrasonic welding or other assembly methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thicknesses of the connection portions are increased to greater than 3 mm to improve bonding strength and creepage distance, then the bonding strength and creepage distance are improved, but material consumption increases
Solution Approach 1:
The patent applies nesting by placing the second case inside the first case through the entrance, with connection portions interlocking via protrusions and trenches. This nested configuration maximizes the use of material within the available space, achieving sufficient bonding strength and creepage distance without requiring excessive material thickness.
Solution Approach 2:
The patent transitions from a single-dimensional thickness increase to a multi-dimensional solution by creating three-dimensional interlocking structures with protrusions and trenches. The connection portions engage in multiple directions (horizontal insertion, vertical bonding), effectively increasing bonding strength and creepage distance without proportionally increasing material consumption.
2Length of stationary object
If the length of the second protrusion is increased to increase the creepage distance, then the creepage distance is improved, but the structural fragility increases and the protrusion is readily fractured under external force
Solution Approach 1:
The patent segments the connection structure into multiple components: the second protrusion for horizontal engagement, the first trench for vertical reception, and the first connection portion as a separate structural element. This segmentation allows the creepage distance to be distributed across multiple structural features rather than relying on a single long protrusion, maintaining structural strength while achieving sufficient creepage distance.
Solution Approach 2:
The patent applies local quality by giving different functional characteristics to different parts of the connection structure. The second protrusion provides horizontal positioning, the first trench provides vertical bonding and creepage path, and the interlocking features provide mechanical strength. Each local region is optimized for its specific function, allowing the structure to achieve both adequate creepage distance and structural strength.
3Device complexity
If conventional connection structures are used to simplify the design, then the device complexity is reduced, but the bonding strength is insufficient and the electronic device fails to withstand stronger impact
Solution Approach 1:
The patent merges multiple functions into the connection portions: mechanical bonding, electrical insulation (creepage distance), and impact resistance. The interlocking structure of protrusions and trenches combines these functions in a single integrated design, achieving sufficient bonding strength and impact resistance without significantly increasing design complexity.
Solution Approach 2:
The patent employs composite structural design by combining different geometric features (protrusions, trenches, interlocking surfaces) within the connection portions. This composite approach creates a structure that exhibits enhanced bonding strength and impact resistance compared to simple single-geometry connections, while maintaining reasonable design complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly increases the creepage distance and bonding strength, improving the electronic device's electric properties and structural integrity, while reducing the risk of fracture under external forces.
Implementation Method 1
the ultrasound generated by the horn of an ultrasonic plastic welding machine produces ultra-frequent sonic vibration on the cases
Implementation Method 2
the upper case 1 and the lower case 2 rub against each other violently and thus the protruding rib 215 on the third protrusion 213 of the lower case 2 can be molten and welded into the inner wall of the first trench 113 of the upper case 1
Data Source
AI summary
The present invention relates to a case assembly structure. The case assembly structure includes a first case and a second case. The first case has a first connection portion including a first protrusion, a first trench and a second protrusion from an external side to an internal side thereof. The second case has a second connection portion including a third protrusion and a second trench from an external side to an internal side thereof. The first trench and the second protrusion of the first connection portion of the first case are corresponding to the third protrusion and the second trench of the second connection portion of the second case, and an inner wall of the first protrusion of the first connection portion of the first case is in contact with the external side of the second connection portion of the second case such that the first case and the second case are combined together.